PEEK Resin Optical Component Thermal Deformation
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Solution Overview
Problem
Conventional resin compositions for optical communication components, such as those based on PPS resin, suffer from thermal deformation during solder reflow due to partial melting of the resin, which compromises dimensional accuracy and reliability.
Innovation Solution
A resin composition for optical communication components is developed, comprising a base resin primarily made of PEEK resin and silica, with a silica content of 55 to 75 mass %. This composition enhances moldability, dimensional accuracy, and thermal deformation resistance by incorporating additional resins like PAS, PES, PEI, or LCP, which offer improved fluidity and high crystallinity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If PPS resin is used in the resin composition, then the resin composition can be easily molded and good dimensional accuracy can be imparted, but thermal deformation occurs during solder reflow due to partial melting of the PPS resin crystal
Solution Approach 1:
The patent changes the resin composition parameters by replacing PPS resin with PEEK resin as the main component, and adjusting the silica content to 55-75 mass %. This parameter change raises the melting point from 280°C (PPS) to above 300°C (PEEK), ensuring the resin does not melt during solder reflow at 260°C while maintaining dimensional accuracy through the high silica content
Solution Approach 2:
The patent uses a composite material system consisting of PEEK resin as the base resin combined with 55-75 mass % silica filler. This composite structure provides both the high heat resistance needed to prevent thermal deformation during solder reflow and the dimensional accuracy required for optical communication components, while the high silica content also improves moldability
2Reliability
If epoxy resin or polyimide resin is used instead of PPS resin to achieve higher heat resistance, then thermal deformation can be suppressed, but the molding cycle becomes long and productivity decreases
Solution Approach 1:
The patent selects PEEK resin with specific parameters (melting point above 300°C, low hygroscopicity) that balance heat resistance with processing characteristics. The resin composition parameters (55-75 mass % silica) are optimized to achieve both high thermal deformation resistance and good moldability, enabling shorter molding cycles compared to epoxy or polyimide resins
3Reliability
If epoxy resin or polyimide resin is used instead of PPS resin to achieve higher heat resistance, then thermal deformation can be suppressed, but hygroscopicity increases causing swelling in long-term use
Solution Approach 1:
The patent changes the resin type from hygroscopic epoxy or polyimide resins to PEEK resin which has low hygroscopicity. Combined with 55-75 mass % silica content, this creates a composite material that provides both high heat resistance to suppress thermal deformation and low moisture absorption to maintain dimensional stability in long-term use
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed resin composition allows for easy molding, maintains good dimensional accuracy, and effectively suppresses thermal deformation of optical communication components even when heated at solder reflow temperatures, ensuring reliable performance and appearance.
Implementation Method 1
PEEK resin, which has low hygroscopicity and does not substantially melt near the solder reflow temperature
Implementation Method 2
the melting point of the PPS resin is about 280° C.... melting of crystal partially occurs at around 260° C. in the PPS resin
Implementation Method 3
the content of the silica in the resin composition for an optical communication component is 55 to 75 mass %... can sufficiently suppress thermal deformation of the optical communication component even when the optical communication component is heated at a solder reflow temperature
Data Source
AI summary
A resin composition for an optical communication component includes a base resin and silica. The base resin contains a polyether ether ketone resin as a main component. The content of the silica in the resin composition is 55 to 75 mass %.