PEEK-TPI Insulated Wire Coating for Strong Metal Adhesion
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Solution Overview
Problem
Existing insulated wires face issues with poor adhesive force between the conductive wire and the insulating layer, primarily due to the poor bonding between metal or alloy conductive wires and thermoplastic resin-based insulating layers, leading to detachment and reduced insulation properties.
Innovation Solution
The insulated wire incorporates a conductive wire directly coated with an insulating layer composed of polyetheretherketone (PEEK) and thermoplastic polyimide (TPI), where the PEEK content is limited to not more than 20%, and the insulating layer is formed through an extrusion process, enhancing adhesive force without the need for an intermediate bonding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an intermediate layer is added between the insulating layer and the conductive wire to increase adhesive force, then the adhesive force is improved, but the preparation process becomes complex and time-consuming
Solution Approach 1:
The patent uses a plasma treatment as an intermediary process between the conductive wire and the insulating layer. The plasma creates a reactive surface layer on the conductive wire that enhances adhesion without requiring a separate intermediate material layer, thus improving adhesive force while avoiding the complexity of adding intermediate layers
Solution Approach 2:
The patent changes the surface parameters of the conductive wire through plasma treatment, modifying the surface energy and roughness to improve adhesion. This parameter change approach achieves enhanced adhesive force without adding structural complexity or intermediate layers
2Strength
If a plasma treatment process is added to the conductive wire before extrusion, then the adhesive force is improved, but the manufacturing process time is increased
Solution Approach 1:
The patent combines the plasma treatment process with the extrusion process into a single continuous operation. The conductive wire undergoes plasma treatment immediately before extrusion without interruption, merging two processes that would otherwise be separate sequential steps, thereby minimizing additional time while achieving improved adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves a strong adhesive force between the insulating layer and the conductive wire, improving the insulation properties, heat resistance, and breakdown voltage of the insulated wire, while also simplifying the manufacturing process and reducing costs.
Implementation Method 1
the insulating layer includes polyetheretherketone and thermoplastic polyimide... a length of the insulating layer losing adhesion is not greater than 1.9 mm
Data Source
AI summary
The present disclosure provides an insulated wire and a preparation method therefor, a winding wire and an electrical device, relating to the technical field of electrochemical elements. The insulated wire includes a conductive wire and an insulating layer coated on the conductive wire, where the insulating layer includes polyetheretherketone and thermoplastic polyimide, and a mass percentage of the polyetheretherketone in the insulating layer is not more than 20%; and the conductive wire is in direct contact with the insulating layer; and after extrusion and cooling for 24 h, under a condition that the insulated wire is ring cut and stretched by 15%, a length of the insulating layer losing adhesion is not greater than 1.9 mm.