PEEK Insulated Wire Bonding Layer for 800 V Motor Insulation
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Solution Overview
Problem
Existing insulated wires with polyetheretherketone (PEEK) resin coatings face issues with delamination and fracture due to poor bonding with copper surfaces, despite improvements in bonding layers, and fail to meet the high-voltage requirements of 800 V motors.
Innovation Solution
An insulated wire structure with a bonding layer containing specific polymerization units and a PEEK resin coating, formed through a method involving diamine, amine, and dianhydride monomers, enhances bonding performance and electrical stability by increasing diether bonds and reducing carboxyl groups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PEEK resin is used as enameling material for high-voltage motors, then electrical insulating performance is improved, but bonding performance with copper surface deteriorates due to large melt viscosity and high cooling rate
Solution Approach 1:
The patent introduces a bonding layer as an intermediary between the PEEK resin insulation layer and the copper conductor. This bonding layer acts as a mediator that resolves the incompatibility between PEEK's poor adhesion to copper and the requirement for strong bonding. The bonding layer contains functional groups that can chemically or physically bond to both the PEEK resin and the copper surface, creating a stable transition zone that prevents delamination while maintaining the electrical insulation properties of the PEEK outer layer.
Solution Approach 2:
The patent creates a composite structure consisting of multiple layers with different functions: the PEEK resin provides electrical insulation and heat resistance, while the bonding layer provides adhesion to the copper conductor. This composite material approach allows each layer to optimize its specific function, with the bonding layer containing reactive functional groups for strong copper bonding and the PEEK layer maintaining its excellent insulating properties, thereby resolving the contradiction between bonding strength and electrical performance.
2Strength
If bonding layer is added between conductor and PEEK resin, then bonding performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the bonding layer formation and PEEK resin coating processes into a single integrated manufacturing step. The bonding layer is applied to the copper conductor, and then the PEEK resin is extruded over it in one continuous operation, rather than as separate sequential steps. This merging of processes reduces manufacturing complexity despite the added functional layer, as the equipment and process parameters are optimized to handle both layers simultaneously.
Solution Approach 2:
The patent optimizes the thermal and chemical parameters of the bonding layer to ensure proper bonding to both copper and PEEK resin. By carefully controlling parameters such as the bonding layer thickness, composition, and curing conditions, the manufacturing process achieves strong adhesion without requiring excessive process steps or complex equipment, thereby balancing improved bonding performance with manageable manufacturing complexity.
3Ease of manufacture
If ordinary polyimide enameled wire is used, then manufacturing is simple, but partial discharge initiation voltage is insufficient for 800 V motors
Solution Approach 1:
The patent changes the material parameter from ordinary polyimide to PEEK resin, which has superior electrical insulating properties and higher partial discharge initiation voltage suitable for 800 V motors. Despite this material upgrade, the patent maintains manufacturing simplicity by using a continuous extrusion process where the bonding layer and PEEK resin are applied in one step, and by optimizing the extrusion parameters to handle PEEK's high melt viscosity, thereby achieving high voltage reliability without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved bonding layer and PEEK resin coating enhance adhesion, reduce metal corrosion, and increase electrical breakdown resistance, ensuring better stability and safety for high-voltage applications.
Implementation Method 1
The structure of the bonding layer comprises a polymerization unit as shown in the formula 5 below and a polymerization unit as shown in the formula 6 below... R1 and R2 are both aryl; and R3 is C2-12 alkyl
Implementation Method 2
Polyether-ether-ketone (PEEK) is a resin excellent in electrical insulating performance, with a volume resistivity of about 1015-1016 Ω·cm, and a low small dielectric constant and a small dielectric loss in a high frequency range
Implementation Method 3
The structure of the bonding layer comprises a polymerization unit as shown in the formula 5 below and a polymerization unit as shown in the formula 6 below... x+y is 10-10000
Data Source
AI summary
An insulated wire and a preparation method thereof, a coil, and an electronic/electrical device are provided. The insulated wire includes a conductor and a bonding layer, and a PEEK resin sequentially arranged on the outer side of the conductor. The structure of the bonding layer includes a polymerization unit and a polymerization unit, and the polymerization unit accounts for 5-15%.