Peel-off Device Blade Angle and Clamp Mechanism
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Solution Overview
Problem
Existing peel-off devices for removing sheets from carrier films in the manufacturing of circuit elements often result in chip formation and damage to the sheets due to improper peeling techniques, which can lead to inefficiencies and material loss.
Innovation Solution
A peel-off device equipped with a sheet table, a blade, and a clamp mechanism, where the blade folds the carrier film's end portion upwards and the clamp mechanism peels it off while moving in a controlled manner to minimize contact and reduce damage, utilizing a blade edge angle between 25 to 60 degrees and air jets to facilitate smooth peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the end portions of the board are cut off to create a holding margin for peeling, then the protective layer can be peeled off, but the cut end portions may be separated and scattered as chips
Solution Approach 1:
The patent introduces a clamp mechanism as an intermediary device that holds the end portion of the board during peeling. Instead of directly pulling the protective layer which causes chips, the clamp mechanism gently grasps the board's end portion and pulls it, mediating the peeling force to avoid chip generation while maintaining effective peeling operation
2Ease of operation
If a roll is pressed against the coverlay film to raise it from the protective film, then peeling can start, but the coverlay film may be damaged due to direct contact
Solution Approach 1:
The clamp mechanism serves as an intermediary that contacts the board's end portion rather than directly pressing against the protective layer or coverlay film. This indirect contact method initiates peeling without the damaging direct pressure that would otherwise be applied to the delicate film surfaces
Solution Approach 2:
The clamp mechanism first secures the end portion of the board before peeling begins. This preliminary action of clamping the board's end portion creates a safe starting point for peeling that prevents direct contact between peeling tools and the vulnerable film surfaces
3Productivity
If the clamp mechanism moves perpendicular to the exposed surface during peeling, then the carrier film can be removed, but the lamination sheet may detach from the sheet table
Solution Approach 1:
The clamp mechanism dynamically adjusts its movement trajectory during peeling. It moves in parallel to the exposed surface of the lamination sheet rather than perpendicular to it, adapting the peeling motion to maintain sheet attachment while still achieving effective carrier film removal. This dynamic movement adjustment resolves the contradiction between peeling speed and sheet stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces chip formation and sheet damage by ensuring controlled peeling, maintaining the integrity of the sheets during the peeling process, thereby enhancing manufacturing efficiency and reducing material loss.
Implementation Method 1
The sheet table suction a lamination sheet in which a sheet is laminated to a carrier film
Data Source
AI summary
A blade includes an edge to be pressed against an end portion of a carrier film to fold the end portion upwards from a sheet. A clamp mechanism peels the carrier film off from the sheet by moving while clamping the upwardly folded end portion of the carrier film.