Peel Strength Measurement Using 3D Adhesion Volume Analysis
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Solution Overview
Problem
Current methods for measuring the peel strength between a carrier tape and a cover tape require cutting samples, leading to waste and potential human error in measurement.
Innovation Solution
A method and apparatus that use a non-contact approach to obtain a 3D image of the adhesion portions between the carrier tape and the cover tape, calculate their volumes, and convert these volumes into peel strengths using a conversion graph.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a part of the carrier tape and cover tape is cut to form a sample for measurement, then the peel strength can be measured using a measurer, but the sample is wasted and human error may occur in measurement
Solution Approach 1:
The patent uses optical imaging to create a digital copy (image) of the adhesion portion between the carrier tape and cover tape. Instead of physically cutting and measuring a sample, the system captures images of the actual adhesion area and calculates peel strength from the image data, eliminating sample waste while maintaining measurement capability
Solution Approach 2:
The patent replaces the mechanical measurement system (cutting samples and using physical measurers) with an optical measurement system. Images are captured and processed computationally to determine adhesion strength, substituting mechanical intervention with optical and computational methods to eliminate human error and material waste
2Measurement precision
If a worker measures the peel strength using a measurer, then the measurement can be performed, but an error may be generated at the measured peel strength due to human involvement
Solution Approach 1:
The system captures images of the adhesion portion, processes the image data through algorithms, and automatically calculates the peel strength. This closed-loop automated process eliminates human subjectivity and error, providing consistent and reliable measurements through computational analysis rather than manual assessment
Solution Approach 2:
The measurement system performs self-assessment by automatically capturing images, processing the data, and calculating peel strength without human intervention. The system serves itself by using its own captured images to determine the adhesion properties, eliminating the need for external human measurers and their associated errors
3Measurement precision
If samples are cut and measured manually, then the peel strength can be obtained, but additional time is required for sample preparation and measurement
Solution Approach 1:
The patent performs the measurement on the actual adhesion portions in their original state without requiring preliminary sample preparation. By capturing images directly from the production line or stored packages, the system eliminates the time-consuming steps of cutting, mounting, and preparing samples before measurement
Solution Approach 2:
The measurement process is integrated into the existing production or storage workflow. Images can be captured continuously from packages on the production line or from stored packages without interrupting the workflow, maintaining continuous productive action while obtaining measurement data
Data Source
AI summary
In a method of measuring peel strengths of adhesion portions between a carrier tape and a cover tape, the carrier tape may include a plurality of pockets configured to receive a plurality of semiconductor packages. A three-dimensional (3D) image of the adhesion portions may be obtained and volumes of the adhesion portions may be determined from the 3D image. The volumes of the adhesion portions may be converted into the peel strengths for the adhesion portions. Thus, it may not be required to form an additional sample so that the expensive sample may not be wasted. Further, the measurement of the peel strength may be performed in packing the semiconductor package so that a packing process may be continuously performed to improve a productivity of the semiconductor packaging.