Peelable Copper Antimicrobial Articles With Patterned Electroless Plating
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Solution Overview
Problem
Existing antimicrobial technologies face challenges in providing effective, cost-efficient, and environmentally safe solutions for applying copper-based antimicrobial agents to various surfaces without using copper nanoparticles or sputtering processes, which are costly, labor-intensive, and pose environmental risks.
Innovation Solution
The development of antimicrobial articles comprising a substrate with a catalytic ink pattern and electrolessly plated copper metal, combined with a peelable liner, which are applied using in-line electroless plating methods, allowing for flexible and lightweight applications on diverse surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper nanoparticles or sputtering processes are used to apply antimicrobial agents, then antimicrobial effectiveness is improved, but manufacturing cost and environmental risk increase
Solution Approach 1:
The patent changes the form of copper from nanoparticles to electrolessly plated copper metal, and changes the deposition method from sputtering to electroless plating. This parameter change maintains antimicrobial effectiveness while significantly reducing manufacturing cost and eliminating environmental risks associated with nanoparticle handling and sputtering processes
Solution Approach 2:
The patent employs a disposable peelable liner that is discarded after use, eliminating the need for complex removal processes and reducing overall manufacturing complexity. The liner provides a simple, cost-effective solution for applying and removing the antimicrobial article from surfaces
2Reliability
If copper metal is plated to provide antimicrobial effect, then antimicrobial activity is improved, but electrical conductivity increases
Solution Approach 1:
The patent applies copper metal in a patterned configuration rather than as a continuous coating. The copper is electrolessly plated only in specific areas where antimicrobial activity is needed, creating local zones of high copper concentration that provide antimicrobial protection while leaving other areas with lower conductivity
Solution Approach 2:
The copper coating is segmented into discrete plated regions rather than forming a continuous conductive layer. This segmentation breaks up electrical conductivity pathways while maintaining sufficient copper presence in each segment to provide antimicrobial activity
3Ease of operation
If peelable liner is added to antimicrobial article, then ease of application is improved, but device complexity increases
Solution Approach 1:
The peelable liner serves as an intermediary component that simplifies the application process. It acts as a temporary carrier that protects the copper pattern during handling and provides a user-friendly interface for applying the antimicrobial article to surfaces, then is easily removed to reveal the functional copper layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The antimicrobial articles exhibit high efficacy in killing bacteria and viruses, including gram-negative and gram-positive bacteria, and certain viruses, with minimal electrical conductivity and environmental impact, while maintaining high light transmittance and ease of application.
Implementation Method 1
a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern
Data Source
AI summary
An antimicrobial article provides antimicrobial properties when applied to various surfaces that are frequently touched. When it is applied after removing the peelable polymeric film or paper, the antimicrobial efficacy can inhibit or reduce the transmission of various microorganisms from one person to another. This antimicrobial article has a substrate comprising first and second opposing surfaces; a catalytic ink disposed as a pattern on the first opposing surface; a pattern of electrolessly plated copper metal disposed in registration with the catalytic ink pattern; and a peelable polymeric film or paper disposed on at least a portion of the second opposing surface of the substrate.

