Peelable Superconductive Conductor for Thin Substrate Repair

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Solution Overview

Problem

The existing methods for repairing superconducting wires face challenges due to the thin substrate thickness, making handling and forming a superconducting layer difficult, and requiring careful handling to avoid damage.

Innovation Solution

A peelable superconductive conductor is developed, comprising a substrate with a superconducting layer on one side and a peelable carrier body on the other, allowing for easy attachment and detachment, enabling repair without damaging the thin substrate, and using a production method that forms a handling carrier body and then a peelable carrier body for attachment and detachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the substrate thickness is reduced to 30 μm or less for repair applications, then the flexibility and ease of attachment improve, but the handling difficulty and risk of damage increase

Engineering Contradiction:

Improveease of attachmentVSAvoidhandling difficulty

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

A peelable carrier body is introduced as an intermediary between the thin substrate and the external environment. The carrier body has a thickness of 50 μm to 100 μm, which is thicker than the substrate, providing mechanical support and protection during handling and attachment operations. The substrate is formed on the carrier body, and the carrier body can be peeled off after the superconducting layer is formed, leaving the thin substrate intact for repair applications.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the substrate thickness is reduced to 30 μm or less, then the adaptability to repair applications improves, but the manufacturing difficulty increases

Engineering Contradiction:

Improveadaptability to repairVSAvoidmanufacturing difficulty

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The carrier body is prepared in advance before the substrate is formed. The substrate is then formed on the carrier body using conventional techniques. This preliminary preparation of the carrier body allows the thin substrate to be manufactured with standard processes, avoiding the need for specialized manufacturing equipment or techniques that would be required if the substrate were handled independently at such thin dimensions.

Inventive Principle:

Principle #10Preliminary action

3Shape

If the substrate thickness is reduced for repair applications, then the profile lowness and invisibility improve, but the structural strength decreases

Engineering Contradiction:

Improveprofile lownessVSAvoidstructural strength

Core Design Contradiction:

ShapeVSStrength

Solution Approach 1:

The structure comprises a composite of the thin substrate and the thicker carrier body. The carrier body provides the necessary structural strength and mechanical properties, while the thin substrate maintains the desired low profile and electrical conductivity. The combination allows the repair patch to be both structurally sound and aesthetically imperceptible when properly installed.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS9508469B2Peelable superconductive conductor, production method of peelable superconductive conductor, and repair method for superconducting wire

Publication Date: 2016.11.29 FURUKAWA ELECTRIC CO LTD

AI summary

A peelable superconductive conductor comprising a superconductive conductor including a substrate and a superconducting layer which is formed on one principal surface of the substrate. The peelable superconductive conductor can further comprise a peelable carrier body, which is formed on a principal surface of the superconductive conductor on an opposite side of the surface on which the superconducting layer is formed.