Peeling Apparatus Liquid Charge Diffusion Semiconductor Yield
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Solution Overview
Problem
The existing peeling techniques for semiconductor devices often result in electrostatic breakdown due to peeling electrification, leading to destruction or characteristic deterioration of semiconductor elements, and existing methods to prevent this are either ineffective or limit the structure of the semiconductor device.
Innovation Solution
A peeling apparatus that uses a flexible substrate to transform and separate the element formation layer from the substrate while supplying liquid to the peeling surface, effectively diffusing electric charge and preventing electrostatic discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If peeling is performed by physical force or laser ablation, then the layer can be separated from the substrate, but electric charge is generated on surfaces and electrostatic breakdown occurs destroying semiconductor elements
Solution Approach 1:
A liquid supply unit introduces liquid as an intermediary substance between the peeling surfaces. The liquid diffuses electric charge generated during peeling, preventing electrostatic discharge from destroying semiconductor elements. This mediator approach directly addresses the harmful electrostatic effect while maintaining the peeling process.
Solution Approach 2:
The invention converts the harmful electric charge generated by peeling electrification into a beneficial effect by using the liquid to diffuse this charge. The previously harmful electrostatic discharge is transformed into a controlled charge diffusion process that protects semiconductor elements while still achieving layer separation.
2Productivity
If conventional peeling methods are used, then separation is achieved, but semiconductor elements are destroyed or characteristics deteriorate due to electrostatic discharge
Solution Approach 1:
The liquid supply unit acts as a mediator during the peeling process, introducing liquid to the peeling interface to diffuse electric charge. This prevents electrostatic breakdown of semiconductor elements, thereby protecting yield by ensuring semiconductor elements maintain their functionality throughout the peeling process.
3Reliability
If high-resistance insulating materials are used in the element formation layer, then device performance is improved, but electrostatic discharge more easily destroys the semiconductor elements
Solution Approach 1:
The liquid introduced by the supply unit serves as a mediator that diffuses electric charge during peeling. This is particularly important for devices using high-resistance insulating materials that are more susceptible to electrostatic discharge damage. The liquid provides a charge diffusion path that protects these vulnerable semiconductor elements while allowing the use of high-performance insulating materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the yield of semiconductor device production by preventing electrostatic breakdown and allowing for the use of high-resistance insulating materials without damaging the semiconductor elements, ensuring a reliable and versatile peeling process.
Implementation Method 1
supplying liquid to the peeling surface, effectively diffusing electric charge and preventing electrostatic discharge
Data Source
AI summary
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the semiconductor element, a substrate over which an element formation layer and a peeling layer are formed and a film are made to go through a gap between pressurization rollers. The film is attached to the element formation layer between the pressurization rollers, bent along a curved surface of the pressurization roller on a side of the pressurization rollers, and collected. Peeling is generated between the element formation layer and the peeling layer and the element formation layer is transferred to the film. Liquid is sequentially supplied by a nozzle to a gap between the element formation layer and the peeling layer, which is generated by peeling, so that electric charge generated on surfaces of the element formation layer and the peeling layer is diffused by the liquid.