Peeling Device with Moving Unit for Substrate Separation
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Solution Overview
Problem
Existing peeling methods for semiconductor substrates often damage the target or support substrates due to excessive force applied during the peeling process, especially when the substrates are large and thin, leading to bending or breaking issues.
Innovation Solution
A peeling device and method that uses a moving unit to gradually peel the support substrate away from the target substrate in the peeling direction, utilizing a flexible elastic member and multiple moving units to distribute the peeling force evenly, reducing the risk of damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the first holding unit is pulled upward by the moving unit during peeling, then the peeling process can be performed, but the elastic member is flexibly deformed and a force acts on one end portion of the support substrate, causing damage to the target substrate or support substrate
Solution Approach 1:
The moving mechanism is made movable in the peeling direction by providing a moving mechanism that can move in the peeling direction, allowing the system to dynamically adjust during the peeling process. This enables the moving unit to follow the substrate's deformation and reduce the harmful force concentrated on one end portion.
Solution Approach 2:
The problem is solved by adding movement freedom in the peeling direction (another dimension) to the moving mechanism. Instead of only vertical movement, the mechanism can now also move in the peeling direction, distributing the force more evenly across the substrate surface.
2Device complexity
If the moving mechanism is fixed to the base portion, then the structure is simple, but the position of one end portion of the support substrate remains unchanged, causing the substrate to be stretched and damaged
Solution Approach 1:
The moving mechanism transitions from a fixed state to a dynamic state where it can move in the peeling direction. This dynamic capability allows the mechanism to accommodate substrate deformation and prevent stretching damage without significantly increasing structural complexity.
Solution Approach 2:
The system changes the movement parameters of the moving mechanism by allowing it to move in the peeling direction in addition to the vertical direction. This parameter change enables the mechanism to adapt to the peeling process and reduce substrate stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the peeling force and minimizes damage to both substrates, allowing for safe and efficient separation of large and thin semiconductor substrates, enhancing the reliability of the peeling process.
Implementation Method 1
the elastic member 721 of the first holding unit 720 is flexibly deformed along with the pulling operation due to elasticity of the elastic member 721
Implementation Method 2
a first holding unit 720 for holding a support substrate S includes an elastic member 721 and a plurality of sucking parts 722
Data Source
AI summary
A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.