Peeling Device Position Adjustment for Wafer Separation
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Solution Overview
Problem
Conventional peeling devices for separating superposed substrates, such as semiconductor wafers, face challenges in accurately peeling off support substrates without damaging the thin and large-diameter wafers, due to inadequate position adjustments and holding mechanisms.
Innovation Solution
A peeling device equipped with a holding unit and position adjustment units that move forward and backward along the side surface of the superposed substrate, allowing for precise positioning and separation of the target and support substrates using a peeling system that includes a peeling station, carry-in/carry-out station, and transfer devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the wafer is joined to a support substrate to strengthen it during transfer and polishing, then the wafer strength is improved, but the complexity of the peeling process increases
Solution Approach 1:
The peeling device is divided into multiple functional units: a first holding unit for the wafer, a second holding unit for the support substrate, and a peeling unit. This segmentation allows independent control of each component, enabling the complex peeling process to be broken down into manageable stages of wafer holding, support substrate holding, and controlled separation.
2Stability of the object's composition
If the wafer is held firmly during peeling to prevent movement, then the peeling stability is improved, but the risk of damaging the thin wafer increases
Solution Approach 1:
The first holding unit and second holding unit are designed with specific local characteristics to hold the wafer and support substrate respectively. The holding units provide localized support at critical positions, allowing stable peeling while avoiding excessive clamping forces that could damage the thin wafer. The peeling unit applies localized force at the interface between substrates.
3Productivity
If the support substrate is peeled off quickly to reduce processing time, then the productivity is improved, but the accuracy of peeling separation decreases
Solution Approach 1:
The peeling process is performed continuously through coordinated movement of the holding units and peeling unit. The first holding unit maintains continuous contact with the wafer while the second holding unit continuously holds the support substrate, and the peeling unit continuously applies separation force. This continuous action enables both speed and precision by eliminating interruptions and maintaining controlled force application throughout the peeling process.
Data Source
AI summary
A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.