Peeling Layer for Flexible OLED Substrate Separation
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Solution Overview
Problem
Defects on the back face of a support substrate, such as marks or foreign matter adhesion, hinder the effective peeling of a resin layer from the substrate during the manufacturing of flexible OLEDs, leading to peeling failures and manufacturing inefficiencies in display devices.
Innovation Solution
A method is introduced where peeling layers are formed at specific abutting positions on the support substrate to reduce bonding forces, allowing for easier peeling by storing and addressing defect areas, and using peeling layers like silicon-based, UV, metal-based, or photocatalyst-based films to facilitate the separation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser light is irradiated at the interface between support substrate and resin layer, then peeling can be achieved, but defects on the back face of the support substrate prevent sufficient laser light power from reaching the interface
Solution Approach 1:
A peeling layer is introduced as an intermediary component between the support substrate and the resin layer. This peeling layer absorbs laser light at specific wavelengths and converts it to thermal energy, which then heats the interface between the support substrate and resin layer, enabling peeling without requiring direct high-power laser irradiation through the defective back face of the support substrate.
Solution Approach 2:
The peeling layer is designed with specific optical parameters (light absorption coefficient) and thermal parameters (thermal conductivity, heat capacity) that differ from both the support substrate and resin layer. By controlling these parameters, the peeling layer can efficiently absorb laser light and transfer heat to the interface, achieving effective peeling even when the support substrate back face has defects that would otherwise block or scatter the laser light.
2Reliability
If peeling layer is formed at abutting positions, then peeling failures are reduced, but manufacturing process complexity increases
Solution Approach 1:
Instead of forming a continuous peeling layer across the entire support substrate, the peeling layer is segmented and formed only at specific abutting positions where defects are likely to occur. This segmentation approach reduces the total amount of peeling layer material needed and simplifies the manufacturing process by targeting only critical areas rather than treating the entire substrate uniformly.
Solution Approach 2:
The peeling layer is applied locally at abutting positions rather than uniformly across the entire support substrate. This local quality approach ensures that peeling assistance is provided precisely where defects are most likely to occur during manufacturing, while avoiding the added complexity and material costs associated with forming a complete peeling layer over the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables successful peeling of the support substrate and resin layer, reducing peeling failures and improving manufacturing yield by localizing stress and preventing light emission failures in the display device.
Implementation Method 1
irradiating an interface between the support substrate and the resin layer with laser light from a back face side of the support substrate
Data Source
AI summary
A method for manufacturing a display device including a light-emitting element, the method includes: storing, in a manufacturing process of the display device, a plurality of abutting positions where a back face of a support substrate locally abuts a manufacturing apparatus; forming, on a surface of the support substrate on a side on which the light-emitting element is to be formed, a peeling layer at a position opposing at least one position of the plurality of abutting positions stored; forming, on the support substrate, a resin layer to cover the peeling layer; forming a TFT layer on the resin layer; forming the light-emitting element on the TFT layer; and peeling the support substrate and the resin layer.