Peeling Method for Flexible Devices Using Light-Activated Resin
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Solution Overview
Problem
Flexible device manufacturing faces challenges with low heat resistance of flexible substrates, leading to unreliable electrical characteristics and low productivity, particularly when trying to transfer semiconductor elements from glass substrates to flexible substrates without compromising reliability or increasing production costs.
Innovation Solution
A peeling method involving a process member with a support substrate, resin layer, element layer, and counter substrate, where the support substrate is peeled using light irradiation and a blade, allowing for high productivity and low-cost manufacturing of flexible devices using large substrates at reduced temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor elements are directly formed on flexible substrates, then manufacturing cost and process complexity are reduced, but electrical characteristics and reliability cannot be improved due to low heat resistance of flexible substrates
Solution Approach 1:
The manufacturing process is segmented into two independent stages: first forming semiconductor elements on a glass substrate (support substrate) where high temperature processing is possible, then transferring the completed element layer to the flexible substrate. This segmentation allows each stage to be optimized independently - the glass substrate stage for reliability and the flexible substrate stage for final device flexibility.
Solution Approach 2:
The glass substrate serves as an intermediary medium that enables high temperature manufacturing of semiconductor elements. After the element layer is formed on the glass substrate, it is transferred to the flexible substrate which acts as the final support. This intermediary approach allows the use of glass substrate's high heat resistance during manufacturing while achieving the final flexible device requirement.
2Reliability
If peeling and transfer method is used to form semiconductor elements on flexible substrates, then electrical characteristics and reliability are improved, but productivity decreases and manufacturing cost increases
Solution Approach 1:
Multiple functions are merged into a single integrated peeling structure. The peeling layer serves simultaneously as: (1) a release layer enabling separation of the element layer from the support substrate, (2) an adhesive layer bonding the element layer to the flexible substrate, and (3) a structural component of the final flexible device. This merging eliminates the need for separate adhesive layers and simplifies the manufacturing process.
Solution Approach 2:
The peeling layer is pre-formed on the support substrate before the element layer is created. This preliminary action ensures that the peeling function is already in place when the element layer is formed, enabling subsequent easy separation and transfer without requiring additional processing steps after element formation.
3Reliability
If conventional peeling methods are used, then transfer of semiconductor elements is achieved, but mass productivity is limited and manufacturing cost is high
Solution Approach 1:
The peeling layer is designed to automatically separate the support substrate from the element layer through light irradiation without requiring manual intervention or complex peeling mechanisms. The light-curable resin material self-activates upon light exposure, enabling automated, high-speed peeling processes that increase productivity and reduce labor costs.
Solution Approach 2:
The peeling layer's properties are dynamically changed through light irradiation. Before irradiation, the peeling layer maintains strong adhesion to hold the element layer. After light irradiation, the peeling layer's adhesion is reduced or eliminated, enabling clean separation. This parameter change allows precise control of the peeling process.
4Productivity
If large substrates are used for manufacturing, then productivity and device area are increased, but handling and processing difficulty increase
Solution Approach 1:
The manufacturing process segments the handling of large substrates into manageable stages. The support substrate and flexible substrate are handled separately during formation, and only the finalized element layer (transfer object) needs to be handled during peeling and transfer. This segmentation reduces the complexity of handling large-area substrates throughout the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of highly reliable flexible devices with improved electrical characteristics and reduced production costs by transferring semiconductor elements from glass to flexible substrates efficiently, maintaining high productivity and low temperature processing.
Implementation Method 1
In a second step, the resin layer is irradiated with light from a laser light source
Data Source
AI summary
A peeling method is provided. In a first step, a resin layer is formed over a support substrate, openings are formed along two opposite sides of a periphery of the resin layer in a top view, an element layer is formed over the resin layer and positioned on an inner side than the openings in the top view, and the support substrate and a counter substrate are bonded to each other so that an adhesive layer is in contact with the support substrate in the openings, thereby forming a process member. In a second step, an entire surface of the process member is irradiated with light from the support substrate side. In a third step, a blade is inserted into an end portion of the process member from an interface between the support substrate and the resin layer or from the resin layer, and is made to pass through the openings.