Peeling Method for Flexible Devices Using Laser Ablation
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Solution Overview
Problem
The peeling process in manufacturing flexible devices such as light-emitting devices and semiconductor devices often results in low yield due to cracking of inorganic insulating films and high susceptibility to impurities, dust, and alignment accuracy issues, particularly when transferring functional elements from a formation substrate to a flexible substrate.
Innovation Solution
A light-emitting device design incorporating a peeling method with a sheet-like adhesive bonding layer, where the bonding layer's hardness is set above Shore D 70 and the coefficient of expansion is less than 58 ppm/°C, and a peeling process involving laser light irradiation to form a peeling starting point, ensuring high reliability and resistance to bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If physical peeling or metal layer interface peeling is used, then the peeling process can be performed, but the yield is low due to cracking of inorganic insulating films and susceptibility to impurities and dust
Solution Approach 1:
The patent introduces a peeling layer as an intermediary between the formation substrate and the layer to be peeled. This peeling layer has a specific structure (first peeling layer with low bonding strength to formation substrate, second peeling layer with high bonding strength to layer to be peeled) that mediates the peeling process, allowing clean separation without damaging the inorganic insulating film or generating impurities.
Solution Approach 2:
The patent changes the bonding strength parameters at different interfaces by designing a multi-layer peeling structure. The first peeling layer is designed with low bonding strength to the formation substrate (using materials like silicon oxide or silicon nitride with controlled thickness), while the second peeling layer has high bonding strength to the layer to be peeled, creating controlled weak and strong bonding zones that enable clean peeling.
2Manufacturing precision
If peeling is performed without a specifically designed peeling layer, then the process is simpler, but alignment accuracy is poor and impurity entry is high
Solution Approach 1:
The patent segments the peeling layer into multiple functional layers (first peeling layer and second peeling layer) with different bonding characteristics. This segmentation allows each layer to perform its specific function: the first layer provides controlled weak bonding for easy separation, while the second layer ensures strong bonding to the layer to be peeled, thereby improving alignment accuracy and reducing impurity entry.
Solution Approach 2:
The patent uses composite material structure for the peeling layer, combining different materials (such as silicon oxide, silicon nitride, and organic insulating materials) with different bonding strengths and physical properties. This composite structure enables precise control over peeling behavior and alignment accuracy during the transfer process.
3Strength
If conventional peeling methods are used, then the device can be transferred, but resistance to repeated bending is poor
Solution Approach 1:
The peeling layer acts as a mediator that enables clean separation without damaging the functional layers. The controlled weak bonding at the first peeling layer/formation substrate interface ensures that peeling occurs at the intended location, preserving the integrity of the transferred device structure, which is crucial for maintaining bending resistance.
Solution Approach 2:
The peeling layer structure is designed and formed in advance during the manufacturing process, preparing the interface for clean separation before the actual peeling occurs. This preliminary structuring ensures that when peeling is performed, the separation is clean and controlled, preserving the device's structural integrity for subsequent bending operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the yield of the peeling process, reduces cracking in inorganic insulating films, minimizes impurity entry, and enhances alignment accuracy, resulting in a highly reliable and flexible device with improved resistance to repeated bending.
Implementation Method 1
The separation layer is ablated by laser light irradiation, so that peeling is generated in the separation layer.
Data Source
AI summary
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.