Peeling Substrate Temperature Control for Flexible Device Yield
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Solution Overview
Problem
The existing methods for peeling functional elements from formation substrates often result in low peelability, leading to high stress on the elements and potential breakage, which necessitates slow peeling processes, thereby degrading throughput in manufacturing processes such as those for semiconductor, light-emitting, and display devices.
Innovation Solution
A peeling method involving the formation of a separation layer, a layer to be separated, and a peeling starting point, where the peeling is performed while controlling the temperature of the substrate and layer to be separated, and optionally using a liquid at a controlled temperature to facilitate peeling, along with static electricity elimination and drying steps to improve peelability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If peeling is performed at room temperature with conventional methods, then the process is simple, but high stress is applied to the functional element causing breakage
Solution Approach 1:
The patent changes the temperature parameter of the peeling process from room temperature to elevated temperature (60-90°C). This parameter change reduces the stress applied to the functional element during peeling, preventing breakage while maintaining process simplicity through automated temperature control.
Solution Approach 2:
The patent introduces a liquid (water or aqueous solution) as an intermediary substance between the peeling interface and the environment. This liquid mediates the peeling process by reducing adhesion forces and stress concentration, thereby protecting the functional element from breakage.
2Reliability
If peeling is performed slowly to prevent breakage, then functional element integrity is maintained, but throughput is degraded
Solution Approach 1:
By changing the temperature parameter to 60-90°C, the patent reduces the peeling force required and improves peelability. This allows faster peeling speeds to be used without causing breakage, thereby maintaining functional element integrity while significantly improving throughput.
Solution Approach 2:
The liquid intermediary reduces friction and adhesion at the peeling interface, enabling smoother and faster peeling motion. This mediator allows the process to proceed at higher speeds without increasing stress on the functional element, thus improving throughput while maintaining reliability.
3Reliability
If conventional peeling methods are used, then equipment is simple, but peelability is low causing high stress and breakage
Solution Approach 1:
The patent employs parameter changes (temperature elevation to 60-90°C) to fundamentally improve peelability. This reduces the force required for peeling and prevents breakage, achieving high reliability while the added temperature control equipment represents manageable complexity.
Solution Approach 2:
The liquid intermediary substance dramatically improves peelability by reducing adhesion forces at the interface. This simple addition of a liquid delivery mechanism achieves high peeling success rates without requiring complex apparatus modifications.
4Productivity
If fast peeling is performed to improve throughput, then productivity increases, but stress causes functional element breakage
Solution Approach 1:
By elevating the temperature to 60-90°C, the patent reduces the peeling force required and improves material ductility. This parameter change enables fast peeling speeds to be used without causing breakage, thus achieving both high throughput and high reliability simultaneously.
Solution Approach 2:
The liquid intermediary reduces friction and adhesion during fast peeling motion, preventing stress concentration even at high speeds. This allows the process to run at high throughput while the liquid mediator continuously protects the functional element from breakage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances peelability, improves yield and throughput, and allows for the production of lightweight, thin, and flexible devices with reduced crack generation during bending, achieving high reliability and flexibility in device manufacturing.
Implementation Method 1
In the fourth step, a temperature of the substrate is higher than or equal to 60° C. and lower than or equal to 90° C.
Implementation Method 2
a liquid supplying step of supplying liquid between the layer to be separated and the separation layer
Data Source
AI summary
An object is to provide a novel peeling method and a novel peeling apparatus. A peeling method including a first step of forming a separation layer over a substrate, a second step of forming a layer to be separated over the separation layer, a third step of forming a peeling starting point by separating part of the layer to be separated from the separation layer, and a fourth step of peeling the layer to be separated from the substrate using the peeling starting point. In the fourth step, the substrate temperature is higher than or equal to 60 degrees Celsius and lower than or equal to 90 degrees Celsius.