Pellicle Capillary Design for Adhesive Residue Removal
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Solution Overview
Problem
Existing techniques for fabricating mask-pellicle systems in the semiconductor industry are not entirely satisfactory due to deficiencies in the pellicle structure and materials used, leading to adhesive residue on the mask after demounting, which requires manual cleaning and risks causing defects.
Innovation Solution
The proposed solution involves a pellicle design with a patterned pellicle frame that includes capillaries of varying depth, which facilitates the removal of adhesive residue during demounting by allowing the adhesive to flow into the capillaries, reducing the need for manual cleaning and minimizing the risk of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pellicle is used to protect the mask, then particle protection is improved, but adhesive residue remains on the mask after demounting
Solution Approach 1:
The pellicle frame is designed with different surface properties in different regions: a first surface with a first set of capillaries for adhesive capture, and a second surface with a second set of capillaries for adhesive capture. This local differentiation allows the pellicle to protect the mask while providing targeted adhesive removal capabilities at specific locations.
Solution Approach 2:
The pellicle frame incorporates capillaries (porous structures) that allow adhesive material to penetrate and be captured within the frame structure. The capillaries act as porous channels that absorb and hold adhesive residue, preventing it from remaining on the mask surface during demounting.
2Object-generated harmful factors
If manual cleaning is performed to remove adhesive residue, then adhesive removal is improved, but the risk of causing defects increases
Solution Approach 1:
The pellicle frame is designed to automatically capture and hold adhesive residue through its capillary structures during the demounting process. The adhesive is drawn into the capillaries by capillary action, eliminating the need for manual cleaning operations and preventing defects that would result from manual intervention near critical pattern areas.
3Ease of manufacture
If the pellicle structure is simplified, then manufacturing is improved, but adhesive removal capability deteriorates
Solution Approach 1:
The pellicle frame is segmented into multiple functional regions with different capillary configurations. The first surface has a first set of capillaries while the second surface has a second set, allowing each region to be optimized for specific adhesive capture functions while maintaining an otherwise simple pellicle structure that can be manufactured using standard techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of adhesive residue causing defects during the demounting process, improving the efficiency and reliability of the mask-pellicle system by allowing for easier and more controlled adhesive removal.
Implementation Method 1
a pattern formed in the pellicle frame, wherein the pattern includes capillaries of varying depth
Data Source
AI summary
The present disclosure provides an apparatus for a semiconductor lithography process. The apparatus includes a mask defining a circuit pattern to be transferred. The apparatus further includes a pellicle including a pattern formed in a first surface, wherein the pellicle is attached to the mask at the first surface. The apparatus also includes an adhesive material layer disposed between the mask and the first surface. The pattern may include a plurality of capillaries. Each capillary of the plurality of capillaries may have a dimension in a plane of the first surface between about 1 μm and about 500 μm. Each capillary of the plurality of capillaries may have a ratio of depth to width greater than or equal to about 100. The adhesive material layer may include an adhesive having a glass transition temperature (Tg) greater than room temperature.