Lithographic Pellicle C Chamfering Adhesion
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Solution Overview
Problem
In semiconductor and liquid crystal display panel production, debris on lithographic masks causes pattern deformation, edge roughness, and background staining due to light absorption or bending, leading to impaired dimensions and quality, and the use of pellicles as debris shields is hindered by protruding pressure-sensitive adhesives and residual haze from materials.
Innovation Solution
A lithographic pellicle with a pellicle frame and film, featuring C chamfering on corners and adhesion faces to prevent adhesive protrusion, and an electrodeposition-coated polymer film to reduce gas generation and haze, ensuring stable adhesion without interfering with the mask's flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If pressure-sensitive adhesive is applied on the pellicle frame to adhere the exposure master plate, then adhesion strength is improved, but adhesive protrudes from the frame width causing yield decrease
Solution Approach 1:
C chamfering is performed on the pellicle frame corners before applying the pressure-sensitive adhesive. This preliminary geometric modification creates a recessed corner region that prevents adhesive from protruding beyond the frame width during the adhesion process, while the main flat surfaces maintain sufficient adhesive contact area for strong bonding.
Solution Approach 2:
The pellicle frame is given different geometric characteristics at different locations: the corner regions have C chamfering (recessed geometry) to contain adhesive, while the central flat regions maintain full width for optimal adhesive contact. This local differentiation allows simultaneous achievement of precise adhesive containment and strong adhesion.
2Strength
If materials forming the pellicle (adhesives, coatings) are used to ensure good adhesion, then adhesion performance is improved, but gas generation occurs forming haze on the exposure master plate
Solution Approach 1:
The materials forming the pellicle (adhesives, inner wall coatings) are selected and formulated to have low gas generation rates. By changing the chemical composition parameters of these materials to minimize volatile content and gas evolution during curing and exposure, haze formation on the exposure master plate is prevented while maintaining adequate adhesion performance.
3Reliability
If the pellicle is adhered directly to the exposure master plate to prevent debris attachment, then debris shield function is improved, but adhesive protrusion interferes with pattern region
Solution Approach 1:
C chamfering is performed on the pellicle frame corners before adhesion to create recessed corners that contain the pressure-sensitive adhesive within the frame boundaries. This preliminary geometric preparation ensures that when the exposure master plate is adhered, no adhesive protrudes into the pattern region, maintaining both debris shield function and pattern cleanliness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents adhesive protrusion and haze formation, enhancing semiconductor production yield by maintaining the adhesion width and ensuring the pellicle does not interfere with the mask's flatness, thus improving pattern quality and production efficiency.
Implementation Method 1
an inner wall coating agent which is formed from an amorphous fluorine polymer and has a coating thickness of 0.01 to 0.05 mm
Implementation Method 2
The pellicle film is formed from nitrocellulose, cellulose acetate, a fluorine-based polymer, etc., which allows exposure light (g rays, i rays, 248 nm, 193 nm, 157 nm, etc.) to easily pass through
Implementation Method 3
a pressure-sensitive adhesion layer made of a polybutene resin, a polyvinyl acetate resin, an acrylic resin, a silicon resin, etc.
Data Source
Figure 1
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AI summary
A lithographic pellicle is provided that includes a pellicle frame, a pellicle film stretched over one end face of the pellicle frame via a pellicle film adhesive, and an exposure master plate adhesive provided on the other end face, wherein corners formed between a pellicle film adhesion face and exposure master plate adhesion face of the pellicle frame and inside and outside faces of the frame are subjected to C chamfering, and the chamfer dimension on the exposure master plate adhesion face is greater than C0.35(mm) but no greater than C0.55(mm).