Pellicle Assembly Manufacturing via Wet-Dry Film Transfer

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Solution Overview

Problem

In the manufacturing of integrated circuit devices, photomasks are prone to contamination and deformation due to foreign materials in the surrounding environment, leading to defects during the lithography process, especially when using EUV light or electron beams where the pellicle membrane's flatness and thickness are critical for accurate pattern transfer.

Innovation Solution

A method of manufacturing a pellicle assembly involves attaching a carbon-containing thin film to a transfer membrane in a wet atmosphere, then to a pellicle frame in a dry atmosphere, and separating the membrane while maintaining the film's integrity, using surface tension and capillary phenomena to ensure even attachment without warpage or deflection, and optionally reducing the film's thickness for optimal exposure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a pellicle membrane is used to protect photomasks from contamination, then protection from foreign materials is improved, but the membrane may warp or deflect due to environmental factors

Engineering Contradiction:
Improvecontamination protectionVSAvoidmembrane flatness
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The patent changes the physical-chemical parameters of the pellicle membrane by forming it from a carbon-containing thin film with controlled thickness (1-100 nm) and composition. The membrane is formed in a vacuum environment and cured at specific temperatures (70-150°C) to achieve optimal flatness and stability while maintaining protection functionality.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a vacuum environment as an inert atmosphere during the formation and curing processes of the pellicle membrane. This prevents contamination from external environmental factors while allowing the membrane to achieve its optimal structural state without warping or deflecting.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

2Stability of the object's composition

If the pellicle membrane is made thinner to reduce warpage, then flatness is improved, but the membrane becomes more susceptible to contamination

Engineering Contradiction:
Improvemembrane flatnessVSAvoidcontamination susceptibility
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent optimizes the thickness parameter of the carbon-containing thin film to a specific range (1-100 nm) that balances flatness and contamination protection. The film is formed through controlled deposition processes and cured under vacuum conditions to achieve this optimal thickness while maintaining structural integrity and protective functionality.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If a complex multi-step process is used to ensure membrane quality, then manufacturing precision is improved, but the process complexity increases

Engineering Contradiction:
Improvemembrane qualityVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the pellicle membrane formation process into distinct steps: (1) forming the carbon-containing thin film on a support substrate, (2) removing the support substrate, (3) curing the film in vacuum, and (4) transferring to the pellicle frame. This segmentation allows each step to be optimized independently while maintaining overall process control and precision.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method prevents errors caused by pellicle membrane deterioration, ensuring accurate pattern transfer by maintaining the film's flatness and thickness, allowing EUV light or electron beams to pass through, thus enhancing the quality of integrated circuit manufacturing.

Implementation Method 1

attaching the carbon-containing thin film onto the transfer membrane using a surface tension and a capillary phenomenon of a liquid

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 2

attaching the carbon-containing thin film onto the transfer membrane using a surface tension and a capillary phenomenon of a liquid

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 3

Decreasing the thickness of the carbon-containing thin film may be performed using a plasma etching process performed in an oxygen or hydrogen atmosphere

Methodology Applied
Scientific EffectPlasma etching: Plasma

Data Source

PatentUS10065402B2Method of manufacturing pellicle assembly and method of photomask assembly including the same
Publication Date: 2018.09.04 SAMSUNG ELECTRONICS CO LTD
  • US10065402B2 patent drawing
  • US10065402B2 patent drawing
  • US10065402B2 patent drawing

AI summary

A method of manufacturing a pellicle assembly, the method including attaching a carbon-containing thin film onto a transfer membrane in a wet atmosphere; attaching the carbon-containing thin film to a pellicle frame in a dry atmosphere while the carbon-containing thin film is attached onto the transfer membrane; and separating the transfer membrane from the carbon-containing thin film while the carbon-containing thin film is attached to the pellicle frame.