Peltier Cooling System for Electronic Component Protection
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Solution Overview
Problem
Existing electronic devices face challenges in withstanding extreme environmental conditions due to the limitations of standard electronic components, particularly in military, aeronautical, and industrial applications, where they must endure mechanical shocks, electromagnetic disturbances, and extreme temperatures, and conventional refrigeration units are bulky, noisy, and require frequent maintenance, leading to integration and obsolescence issues.
Innovation Solution
A protection system comprising a housing with physically and thermally isolated compartments, utilizing Peltier modules for cooling, an external radiator with fans for heat evacuation, and a control circuit for temperature regulation, which allows for modular integration of off-the-shelf electronic components while providing mechanical protection and efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional refrigeration units are used to cool electronic components, then cooling capability is provided, but the device becomes bulky and integration becomes difficult
Solution Approach 1:
The patent replaces the conventional mechanical refrigeration system (compressor, condenser, evaporator) with a solid-state Peltier module-based cooling system. The Peltier module directly converts electrical energy to thermal energy transfer without moving parts, eliminating the bulky mechanical components while providing effective cooling for electronic components.
Solution Approach 2:
The patent extracts and removes the bulky mechanical refrigeration components (compressor, condenser, evaporator) from the device, retaining only the essential cooling function through a compact Peltier module. This extraction eliminates the volume occupied by conventional refrigeration units while maintaining cooling capability.
2Temperature
If conventional refrigeration units are used, then cooling is provided, but maintenance requirements increase and reliability decreases
Solution Approach 1:
The patent replaces the mechanical refrigeration system with a solid-state Peltier module that has no moving parts, eliminating wear and tear associated with mechanical components. This substitution dramatically reduces maintenance requirements and improves reliability, as the Peltier module cannot suffer breakdowns from mechanical failure.
Solution Approach 2:
The patent employs a disposable or long-lasting solid-state cooling element (Peltier module) that does not require maintenance like conventional mechanical systems. The simplicity and robustness of the Peltier module allow it to operate reliably for the entire device lifespan without requiring maintenance interventions.
3Adaptability or versatility
If off-the-shelf electronic components are used, then component availability is improved, but integration complexity increases due to obsolescence and dimensional variations
Solution Approach 1:
The patent divides the electronic device into modular compartments (first compartment for control electronics, second compartment for cooled components) with standardized interfaces. This segmentation allows off-the-shelf components to be independently selected and integrated without requiring complete redesign of the entire device, reducing integration complexity while maintaining adaptability to component obsolescence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of hardened electronic devices with enhanced resistance to environmental conditions, simplified maintenance, and adaptability to various components without the need for complete redevelopment, ensuring reliable operation in extreme environments.
Implementation Method 1
a cooling device (6) comprising at least one Peltier module (61)
Implementation Method 2
an external radiator (64) connected to the Peltier modules
Implementation Method 3
at least one fan (71) to expel the heat generated by the external heatsink from the enclosure
Implementation Method 4
The additional stage (7) includes at least one fan (71) to expel the heat generated by the external heatsink from the enclosure
Implementation Method 5
The inner walls of the second enclosure are at least partially covered with a thermally insulating material
Data Source
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AI summary
This protection system (2) for electronic equipment comprises a housing including a first compartment (3) and a second compartment (4), the first compartment (4) delimiting a first closed enclosure (31), the second compartment delimiting a second closed enclosure (41) separate from the first enclosure and suitable for receiving at least one electronic component, the second compartment (4) comprising a cooling system including at least one Peltier module fixed to the bottom of the second enclosure.