Peltier Heat Pipe Unit for Simultaneous Heating and Cooling

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Solution Overview

Problem

Conventional methods for maintaining perishable foods at desired temperatures in buffet settings rely on bulky and costly refrigeration systems or hazardous flame sources, which are inefficient and pose health risks, and lack portability and convenience.

Innovation Solution

A temperature control apparatus using semiconductor Peltier devices and heat pipes to efficiently heat or cool serving surfaces, with a control device managing the activation of Peltier devices based on temperature settings and incorporating hysteresis to reduce cycling, allowing for simultaneous heating and cooling operations without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional refrigeration systems are used to cool perishable foods, then cooling effectiveness is improved, but device complexity and cost increase

Engineering Contradiction:
Improvecooling effectivenessVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical refrigeration systems (compressors, condensers, expansion valves) with a semiconductor Peltier device that uses electrical current to directly pump heat. This substitution eliminates complex mechanical components while maintaining cooling effectiveness, directly resolving the contradiction between reliability and device complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the operating parameters by using solid-state semiconductor materials with specific thermoelectric properties (Seebeck coefficient, electrical conductivity, thermal conductivity) to achieve cooling through electrical parameter control rather than mechanical parameter control. This allows precise temperature control with simpler system architecture

Inventive Principle:
Principle #35Parameter changes

2Power

If flame sources are used to heat foods, then heating capability is improved, but harmful factors increase

Engineering Contradiction:
Improveheating capabilityVSAvoidcombustion products
Core Design Contradiction:
PowerVSObject-generated harmful factors

Solution Approach 1:

The patent replaces flame-based thermal heating with Joule heating through resistive heating elements or direct Peltier device operation in reverse mode. This substitution eliminates combustion processes and harmful emission products while maintaining effective heating capability through electrical energy conversion to thermal energy

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the heating mechanism from chemical combustion to electrical resistance heating, altering the energy conversion pathway from chemical energy to electrical energy to thermal energy. This parameter change eliminates the generation of combustion products while preserving heating power

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional cooling media are used, then cooling function is improved, but portability deteriorates

Engineering Contradiction:
Improvecooling functionVSAvoidportability
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The patent extracts and eliminates the need for heavy conventional cooling media (ice, large quantities of gel packs, bulky refrigeration units) by using a compact semiconductor Peltier device that generates cooling effects through electrical current. This extraction of unnecessary mass directly improves portability while maintaining cooling function

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention employs thin-film semiconductor structures and compact heat sink designs that minimize the physical footprint and weight of the cooling system. The Peltier device itself is a thin solid-state component that can be integrated into portable containers, dramatically reducing weight compared to conventional cooling media

Inventive Principle:
Principle #30Flexible shells and thin films

4Measurement precision

If active exchange devices are used for temperature control, then temperature regulation is improved, but device complexity and cost increase

Engineering Contradiction:
Improvetemperature regulationVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent implements self-regulating temperature control through the inherent properties of the Peltier device and passive heat dissipation systems. The device automatically adjusts heat pumping based on temperature differential and electrical current control without requiring complex active exchange mechanisms, reducing system complexity while maintaining precise temperature regulation

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The invention incorporates temperature sensing and electrical current control feedback loops that automatically adjust the Peltier device operation to maintain desired temperature. This feedback mechanism provides precise temperature regulation through simple electrical control rather than complex mechanical active exchange devices

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus provides efficient, safe, and portable temperature control for serving surfaces, reducing energy consumption and health risks while maintaining food safety and presentation quality.

Implementation Method 1

at least one Peltier device that transfers heat from the serving surface to a heat pipe

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

a heat pipe and a heat sink. Heat is transferred to or from the serving surface through a semiconductor device (e.g., a Peltier device), a heat pipe and a heat sink

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Data Source

PatentUS8850829B2Heating and cooling unit with semiconductor device and heat pipe
Publication Date: 2014.10.07 SOUTH OCEAN HOTEL DEVICE PROD
  • US8850829B2 patent drawing
  • US8850829B2 patent drawing
  • US8850829B2 patent drawing

AI summary

Aspects of the invention support simultaneous operation of a cooling side and a heating side of an apparatus to change the temperatures of a cooling serving surface and a heating serving surface, respectively. A cooling semiconductor device (which may comprise one or more Peltier devices) transfers heat from its top to its bottom while a heating semiconductor device (which may similarly comprise one or more Peltier devices) transfers heat from its bottom to its top. A heat pipe transfers waste heat from the cooling semiconductor device's bottom to the heating semiconductor device's bottom and waste cold from the heating semiconductor device's bottom to the cooling semiconductor device's bottom.