Peltier-Cooled Semiconductor Package With Recessed Thermal Isolation
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Solution Overview
Problem
The existing semiconductor devices with Peltier effect elements face challenges in improving cooling efficiency due to heat transfer between the heat discharge and heat absorption sides.
Innovation Solution
The semiconductor device incorporates a Peltier effect element attached to a semiconductor element without a wiring substrate, with a package substrate featuring a recess or through hole to accommodate the Peltier effect element, increasing the distance between heat absorption and discharge electrodes and reducing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the Peltier effect element is attached without a wiring substrate, then the device structure is simplified and manufacturing is easier, but the height of the Peltier element cannot be easily secured and heat transfer between electrodes increases
Solution Approach 1:
The patent applies local quality by creating a recess structure at the specific location where the Peltier element is mounted. This recess provides localized height control and thermal isolation exactly where needed, while the rest of the device maintains the simplified no-wiring-substrate structure. The recess acts as a localized feature that solves the height and heat transfer problems without adding overall device complexity.
Solution Approach 2:
The recess structure serves as an intermediary element between the Peltier element and the surrounding device structure. It provides the necessary height control and thermal isolation function without requiring a separate wiring substrate. The recess mediates between the simplified attachment approach and the need for precise height control and heat management.
2Reliability
If the distance between heat absorption and discharge electrodes is increased, then heat transfer between electrodes is suppressed and cooling efficiency improves, but the device height increases
Solution Approach 1:
The Peltier element is nested within the recess structure of the device. This nesting arrangement allows the Peltier element to be positioned at an optimal height for thermal isolation while maintaining a compact overall device profile. The recess provides the necessary vertical separation for heat management without adding excessive device height.
3Manufacturing precision
If a wiring substrate is used to attach the Peltier effect element, then the height of the Peltier element can be secured, but the device structure becomes more complex and manufacturing becomes more difficult
Solution Approach 1:
The patent extracts the wiring substrate from the device structure, eliminating it entirely. Instead of using a separate wiring substrate to provide height control and electrical connections, the design integrates these functions directly into the device structure through the recess and direct attachment approach, thereby reducing overall device complexity.
Solution Approach 2:
The patent merges multiple functions into the device structure itself. The recess serves both as a mechanical support for height control and as part of the thermal management system. The direct attachment of the Peltier element to the device structure combines mechanical mounting and electrical connection functions, eliminating the need for a separate wiring substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the cooling efficiency of the Peltier effect elements by reducing heat transfer between the electrodes, allowing for improved thermal management of the semiconductor element.
Implementation Method 1
a Peltier effect element that is attached to a first surface of the semiconductor element without a wiring substrate
Data Source
AI summary
There is provided a semiconductor device that can improve cooling efficiency of Peltier effect elements. A semiconductor device includes: semiconductor elements; Peltier effect elements that are attached to first surfaces of the semiconductor elements without a wiring board; and a package substrate to which the semiconductor elements are attached. A region of the package substrate facing the first surfaces of the semiconductor elements is provided with a first recess or a through hole. The Peltier effect element is disposed in the first recess or in the through hole.