Peltier-Cooled Semiconductor Package With Thermal Isolation Bonding

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Solution Overview

Problem

Heat generated by a Peltier element in electronic components can be transmitted to semiconductor elements via wirings, leading to temperature rise and noise in signal output.

Innovation Solution

An electronic component design featuring a base member, Peltier element, semiconductor element, and frame member, where the base and frame are bonded with a bonding member having lower thermal conductivity, and conductive wires connect electrodes to minimize heat transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the base member and frame member are bonded directly with high thermal conductivity material, then heat dissipation is improved, but heat is transmitted to the semiconductor element causing temperature rise

Engineering Contradiction:

Improvetemperature rise of semiconductor elementVSAvoidheat dissipation efficiency

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

A bonding member with low thermal conductivity is introduced as an intermediary between the base member and frame member. This bonding member acts as a thermal barrier that prevents heat transmission from the frame member to the base member while still providing mechanical bonding, thereby resolving the contradiction between heat dissipation and temperature control

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding member is specifically designed with localized low thermal conductivity properties at the critical interface between base member and frame member. This creates a thermal insulation zone precisely where heat transmission needs to be blocked, while allowing other parts of the structure to maintain their thermal characteristics

Inventive Principle:

Principle #3Local quality

2Temperature

If a Peltier element is added for cooling, then temperature control is improved, but heat is still transmitted via wirings causing noise

Engineering Contradiction:

Improvetemperature control of semiconductor elementVSAvoidnoise in signal output

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The harmful heat transmission path through the wirings is extracted and isolated from the semiconductor element. The bonding member structure creates a thermal barrier that separates the heat generation source (Peltier element and frame member) from the semiconductor element, removing the noise-inducing thermal interference while preserving the cooling function

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The low thermal conductivity of the bonding member, which initially seems to hinder heat dissipation, is converted into a beneficial thermal barrier that protects the semiconductor element from heat transmission. The structure transforms potential harm (heat transmission through bonding paths) into benefit (thermal isolation and noise reduction)

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively suppresses temperature rise in semiconductor elements, reducing noise in signal output and enhancing bonding reliability while maintaining compact size.

Implementation Method 1

a Peltier element arranged as a cooling member between the signal processing device and the base member of a package

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

the base member and the frame member are bonded by a bonding member having a lower thermal conductivity than the base member

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20260026347A1Electronic component and equipment

Publication Date: 2026.01.22 CANON KK

AI summary

An electronic component is provided. The component includes: a base member, a Peltier element; a semiconductor element placed on a placement surface of the base member via the Peltier element; and a frame member arranged so as to surround a side surface of the semiconductor element. A first electrode provided in the semiconductor element is connected, via a conductive wire, to a second electrode provided in the frame member, and the base member and the frame member are bonded by a bonding member having a lower thermal conductivity than the base member.