Peltier Sensor Package Layout for Foreign Matter Isolation
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Solution Overview
Problem
Foreign matters such as dust can adhere to a Peltier element during handling processes and potentially move inside an airtight sealed package, affecting the operation of a sensor element within the package.
Innovation Solution
A sensor apparatus design that includes a package substrate with recess portions and a ceramic interposer substrate positioned between the Peltier element and the sensor element, along with a seal-glass-equipped lid to create airtight sealing, thereby preventing the movement of foreign matters from the Peltier element to the sensor element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the Peltier element is handled during manufacturing and assembly processes, then the Peltier element can be attached to the package, but foreign matters such as dust may adhere to the Peltier element and move inside the package affecting the sensor element
Solution Approach 1:
A cover member is introduced as an intermediary component that covers the Peltier element during assembly processes. This cover member acts as a barrier between the Peltier element and the external environment, preventing foreign matters from adhering to the Peltier element while allowing the assembly process to proceed normally
Solution Approach 2:
The cover member is attached to the Peltier element before the Peltier element is placed inside the package. This preliminary protective action ensures that the Peltier element is already protected against foreign matter contamination during subsequent handling and assembly operations
2Object-affected harmful factors
If the package is designed with airtight sealing to prevent foreign matter entry, then contamination is reduced, but the structure becomes more complex
Solution Approach 1:
The protection strategy is divided into two segments: a cover member that protects the Peltier element specifically, and a lid that seals the package. This segmentation allows each component to perform its protective function independently without requiring a completely redesigned complex package structure
Solution Approach 2:
The cover member serves as an intermediary protective layer between the Peltier element and the package interior environment. This intermediary structure provides contamination protection without requiring the entire package to be redesigned with complex airtight sealing mechanisms
3Reliability
If foreign matters detach from the Peltier element and move inside the package, then the sensor element operation is affected, but increasing protection measures may complicate the assembly process
Solution Approach 1:
The cover member is attached to the Peltier element in advance, before the Peltier element is placed inside the package. This preliminary protective measure prevents foreign matter from adhering to the Peltier element during assembly, ensuring sensor element reliability without adding complex assembly steps
Solution Approach 2:
The cover member acts as an intermediary barrier that prevents foreign matters from detaching from the Peltier element and moving inside the package. This simple intermediary structure protects the sensor element operation without complicating the assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the adherence of foreign matters to the sensor element, minimizing operational interference and enhancing the reliability and airtightness of the sensor apparatus.
Implementation Method 1
An airtight sealed package incorporating a Peltier element is known as means of cooling a solid-state imaging apparatus
Data Source
AI summary
Provided is a sensor apparatus that can suppress movement of foreign matter from a Peltier element to a sensor element. The sensor apparatus includes a package substrate, a Peltier element, a circuit substrate, and a sensor element. The package substrate has a recess portion on a side of a first surface and plural terminals on a side of a second surface located on an opposite side of the first surface. The Peltier element is arranged in the recess portion. The circuit substrate is arranged on an opposite side of a bottom surface of the recess portion with the Peltier element sandwiched therebetween. The sensor element is attached to an opposite side of a surface, the surface being opposed to the Peltier element.