Peltier Sensor Package Layout for Efficient Heat Dissipation
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Solution Overview
Problem
Existing sensor devices face challenges in effectively dissipating heat, particularly in hermetically sealed packages incorporating Peltier elements, which affect the performance and efficiency of sensor elements.
Innovation Solution
The sensor device incorporates a Peltier element thermally connected to a cooling surface and a package substrate with a heat dissipation member made of a material with higher thermal conductivity than the substrate, enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a hermetically sealed package with a Peltier element is used for cooling the sensor element, then the sensor element can be cooled down, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The package substrate is divided into a first region (under the Peltier element) and a second region (peripheral region). The first region uses a material with lower thermal expansion coefficient for precise thermal management, while the second region uses a material with higher thermal conductivity for efficient heat dissipation. This segmentation allows simultaneous optimization of both cooling precision and heat dissipation efficiency.
Solution Approach 2:
Different regions of the package substrate are assigned different thermal properties: the first region has lower thermal expansion coefficient to maintain dimensional stability under the Peltier element, while the second region has higher thermal conductivity to rapidly dissipate heat from the sensor element. This local quality differentiation resolves the contradiction between precise cooling and efficient heat dissipation.
2Loss of energy
If the package substrate material has high thermal conductivity for heat dissipation, then heat dissipation efficiency improves, but thermal expansion mismatch with the light receiving glass plate increases
Solution Approach 1:
The package substrate is segmented into two regions with different materials: the first region under the Peltier element uses a material with thermal expansion coefficient close to the light receiving glass plate to maintain adhesion, while the second peripheral region uses a material with high thermal conductivity for heat dissipation. This segmentation resolves the contradiction between adhesion stability and heat dissipation efficiency.
Solution Approach 2:
The package substrate exhibits local quality differentiation where the first region has low thermal expansion coefficient for stable adhesion, and the second region has high thermal conductivity for heat dissipation. This local property assignment allows the substrate to simultaneously satisfy both adhesion requirements and heat dissipation requirements without compromise.
3Ease of manufacture
If a single material is used for the package substrate, then manufacturing is simplified, but both precise cooling and efficient heat dissipation cannot be achieved simultaneously
Solution Approach 1:
The package substrate is segmented into two regions with different materials optimized for different functions: the first region for thermal management and the second region for heat dissipation. This segmentation enables simultaneous achievement of precise cooling and efficient heat dissipation, overcoming the limitations of single-material substrates.
Solution Approach 2:
The package substrate is constructed as a composite structure with two different materials: one with lower thermal expansion coefficient for dimensional stability and another with higher thermal conductivity for heat dissipation. This composite material approach allows the substrate to exhibit multiple desirable thermal properties that cannot be achieved with a single material, resolving the contradiction between manufacturing simplicity and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation, maintaining the performance and efficiency of the sensor device by effectively managing thermal energy.
Implementation Method 1
a Peltier element, a sensor element thermally connected to a cooling surface of the Peltier element
Implementation Method 2
the sensor element thermally connected to a cooling surface of the Peltier element
Implementation Method 3
the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element
Data Source
Figure 1
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AI summary
A sensor device (1) according to the present disclosure includes: a Peltier element (20); a sensor element (10) thermally connected to a cooling surface (21a) of the Peltier element (20); and a package substrate (40) that is thermally connected to a heat dissipation surface (23a) of the Peltier element (20) and accommodates the Peltier element (20) and the sensor element (10). In addition, the package substrate (40) has a heat dissipation member (46), made of a material having a higher thermal conductivity than a material of the package substrate (40), on at least a part of a surface facing the heat dissipation surface (23a) of the Peltier element (20).