Tempering module with peltier elements
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Solution Overview
Problem
Tempering modules with multiple Peltier elements and a single heated and single cooled heatsink experience thermal expansion, leading to bending and changes in surface flatness, which can result in premature failure of the Peltier elements.
Innovation Solution
The tempering module is designed with each Peltier element oriented such that its hot side is in thermal contact with a common shared hot heatsink, and its cold side is in contact with an individual cold heatsink, ensuring that each Peltier element has its own cooled heatsink, thereby maintaining surface flatness during thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple Peltier elements share a single common heated heatsink and single common cooled heatsink, then device complexity is reduced, but thermal expansion causes bending and loss of surface flatness leading to reduced reliability
Solution Approach 1:
The patent segments the heatsink configuration by providing individual cooled heatsinks for each Peltier element while maintaining a common heated heatsink. This segmentation allows each Peltier element to be thermally isolated on the cold side, preventing bending and maintaining surface flatness during thermal cycles, thereby resolving the reliability issue without excessive complexity.
Solution Approach 2:
The patent applies local quality by giving each Peltier element its own dedicated cooled heatsink with customized thermal management, while the heated side remains shared. This localized thermal management ensures that thermal expansion affects only individual elements rather than causing overall module bending, thus improving reliability.
2Reliability
If individual cooled heatsinks are provided for each Peltier element, then surface flatness is maintained during thermal expansion, but device complexity increases
Solution Approach 1:
The patent implements segmentation by providing individual cooled heatsinks for each Peltier element. This segmentation maintains surface flatness for each element during thermal expansion while keeping the overall structure organized and manageable, thus improving reliability without excessive complexity.
Solution Approach 2:
The patent merges the heated heatsink into a single common component while keeping cooled heatsinks individual. This merging reduces the total number of heatsinks compared to having completely separate heated and cooled heatsinks for each element, thereby reducing device complexity while maintaining the reliability benefits of individual cooled heatsinks.
3Loss of energy
If a spacer is inserted between Peltier element and heatsink to increase insulation layer, then unwanted heat exchange is reduced, but thermal contact resistance increases
Solution Approach 1:
The patent applies local quality by using spacers only at specific locations where thermal insulation is most needed, rather than uniformly throughout the heatsink interface. This localized approach reduces unwanted heat exchange between adjacent Peltier elements while maintaining efficient thermal contact where required, thus improving energy efficiency.
Solution Approach 2:
The spacer acts as an intermediary component that provides thermal insulation between the Peltier element and the heatsink while still allowing controlled thermal contact. This intermediary structure reduces unwanted heat exchange pathways without completely blocking the desired heat transfer, thus improving energy efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration extends the lifetime of the Peltier elements by preventing bending and maintaining surface flatness, reduces the failure rate, and allows for easy replacement and reconfiguration of the cooled heatsinks.
Implementation Method 1
A Peltier element is an electronic component that, when an electric current passes through it, develops different temperatures at the contact surfaces of two conductors (the so-called Peltier effect). Thus, when an electric current passes through the element, the Peltier element behaves like a heat pump, with one side of the element heating up at the expense of the other side, which cools down.
Implementation Method 2
For efficient heat transfer, heatsinks are mounted on the cold and hot sides of the Peltier elements. Both heatsinks are flushed with a liquid medium, usually air.
Implementation Method 3
In order to maximize the heat transfer between the Peltier element, the heated heatsink, the spacer and the cooled heatsink, a thermally conductive paste is applied to their contact surfaces.
Implementation Method 4
As the electric current passes through the Peltier elements, the heated heatsink starts to lengthen, and the cooled heatsink shortens due to thermal expansion.
Data Source
AI summary
The invention relates to a tempering module comprising at least two Peltier elements (2), wherein each Peltier element (2) has a first side and a second side, and wherein said at least two Peltier elements (2) are oriented with their first side so as to be in thermal contact with a common shared first heatsink (1). Each Peltier element (2) is oriented with its second side so as to be in thermal contact with a separate second heatsink (4). The invention further relates to a tempering chamber comprising said tempering module.