Penetrating Electrode Temperature Switch via Thermal Expansion
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Solution Overview
Problem
In electronic devices, particularly semiconductor devices, there is a need for a compact temperature measurement solution that does not increase circuit size, as existing methods require detection elements, driving circuits, and output processing circuits, which can be cumbersome.
Innovation Solution
An electronic device with a substrate having penetration holes and electrodes, where a penetrating electrode with a higher linear thermal expansion coefficient than the substrate is used to create a temperature switch by varying its contact with an electrode based on temperature, allowing for a simple structure that adjusts its on/off state with temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional temperature measurement system with detection elements, driving circuits, and output processing circuits is used, then temperature measurement capability is achieved, but circuit size and complexity increase
Solution Approach 1:
The patent extracts the temperature measurement function from a complex multi-component system and implements it through a simple penetrating electrode structure that utilizes thermal expansion differences. The temperature detection capability is achieved by observing contact state changes between the penetrating electrode and electrode, eliminating the need for separate detection elements, driving circuits, and output processing circuits.
Solution Approach 2:
The penetrating electrode serves dual functions: it acts as both the structural component filling the penetration hole and the temperature detection element. The electrode's thermal expansion properties enable it to automatically indicate temperature changes through contact state changes with the electrode, without requiring external detection mechanisms or processing circuits.
2Measurement precision
If a conventional temperature measurement system with multiple circuits is used, then temperature measurement capability is achieved, but circuit size increases
Solution Approach 1:
The patent merges the temperature detection function with the existing penetrating electrode structure. The penetrating electrode, which is already present to fill the penetration hole, is utilized as the temperature sensing element. This integration eliminates the need for separate detection elements and circuits, significantly reducing the overall circuit area while maintaining temperature measurement capability.
3Adaptability or versatility
If a penetrating electrode with higher linear thermal expansion coefficient than substrate is used, then temperature switch functionality is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes changes in physical parameters, specifically the linear thermal expansion coefficient, to achieve temperature switch functionality. By selecting a penetrating electrode material with a higher thermal expansion coefficient than the substrate, the electrode expands more than the substrate when heated, causing it to contact the electrode and switch the circuit on. This parameter-based approach enables automatic temperature sensing without complex control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact temperature switch that adjusts its electrical connectivity based on temperature, reducing circuit complexity and size while effectively measuring temperature changes, allowing for efficient temperature monitoring in electronic devices.
Implementation Method 1
a penetrating electrode with a higher linear thermal expansion coefficient than the substrate is used to create a temperature switch by varying its contact with an electrode based on temperature
Implementation Method 2
forming a seed layer in the first penetration hole and the second penetration hole
Implementation Method 3
forming a first penetrating electrode in the first penetration hole and a second penetrating electrode in the second penetration hole by plating using the seed layer as a seed
Data Source
AI summary
An electronic device includes: a substrate that includes a first penetration hole; a first electrode that is located on a first surface of the substrate so as to cover the first penetration hole; and a first penetrating electrode that is located in the first penetration hole and is in contact with or away from the first electrode depending on temperature.


