Penetration Electrode Elastic Support for Thermal Stress
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Solution Overview
Problem
Conventional semiconductor packages experience stress and cracking issues due to thermal expansion coefficient mismatches between semiconductor chips and wiring boards, leading to potential damage when heat is applied.
Innovation Solution
The introduction of a semiconductor package design featuring a penetration electrode with elastic supporting portions that penetrate the semiconductor chip or substrate without contacting its walls, allowing for thermal expansion and reducing stress at the joining interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor device is directly mounted on a wiring board, then electrical connection is achieved, but thermal stress causes cracks at the joining portion
Solution Approach 1:
The patent introduces a penetration electrode as an intermediary component between the semiconductor device and wiring board. This penetration electrode includes an elastic supporting portion that acts as a mediator to absorb and distribute thermal stress, preventing direct stress transmission to the joining portion and thereby preventing cracks while maintaining electrical connection reliability.
2Reliability
If rigid electrode structure is used, then electrical connection is stable, but thermal expansion mismatch causes stress concentration
Solution Approach 1:
The patent transforms the rigid electrode structure into a dynamic structure by incorporating an elastic supporting portion. This elastic component can dynamically adjust and deform in response to thermal expansion differences, allowing the electrode to maintain electrical connection stability while accommodating dimensional changes and reducing stress concentration through controlled elastic deformation.
Solution Approach 2:
The patent changes the physical parameter of the electrode structure by introducing elasticity through the elastic supporting portion. This parameter change allows the electrode to transition from a rigid state that concentrates stress to a flexible state that can absorb thermal expansion mismatch, thereby reducing stress concentration while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively relaxes thermal stresses at the joining interface, preventing cracks and ensuring reliable electrical and mechanical connectivity between the semiconductor device and the wiring board even under heat application.
Implementation Method 1
a first supporting portion having elasticity, which is constructed with the penetration portion in an integral manner and is fixed on the one plane; and a second supporting portion having elasticity, which is constructed with the penetration portion in an integral manner and is fixed on the other plane
Implementation Method 2
Due to such a difference between the thermal expansion coefficients, there is a problem that when heat is applied to the semiconductor package 300, stresses are produced in joining portions
Data Source
AI summary
A semiconductor package includes: a wiring board; and a semiconductor device which is formed on the wiring board; wherein the semiconductor device includes: a semiconductor chip; and a penetration electrode, one end of which is fixed on one plane of the semiconductor chip, and the other end of which penetrates the semiconductor chip and is fixed on the other plane of the semiconductor chip, the penetration electrode penetrating the semiconductor chip in such a manner that the penetration electrode is not contacted to a wall plane of the semiconductor chip by a space portion formed in the semiconductor chip; and the wiring board and the semiconductor device are electrically connected via the penetration electrode.