Per-Block Thermal Ceiling Control in Integrated Circuits
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Solution Overview
Problem
Existing integrated circuits (ICs) are limited by a fixed thermal balance point determined through pre-silicon worst case analysis, which pessimistically constrains system performance and introduces potential overheating and abnormal operations.
Innovation Solution
An IC configured for adaptive thermal ceiling control in a per-functional-block manner, utilizing temperature sensors and thermal control circuits to monitor and manage temperature limits dynamically, allowing for configurable thermal operation capabilities based on specific functional block needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixed thermal balance point is used based on pre-silicon worst case analysis, then system reliability is improved by preventing overheating, but system performance deteriorates due to pessimistic constraints
Solution Approach 1:
The patent applies dynamics by transitioning from a fixed thermal balance point to a dynamic thermal ceiling that adapts based on actual post-silicon thermal characteristics. The thermal ceiling is no longer static but adjusts according to measured temperature data from temperature sensors, allowing the system to optimize performance while maintaining safety.
Solution Approach 2:
The patent changes the thermal management parameter from a fixed pre-silicon worst-case value to a configurable post-silicon measured value. By using actual thermal characteristics measured after silicon fabrication, the system can set more accurate and less conservative thermal ceilings, improving performance without compromising reliability.
2Ease of manufacture
If a fixed thermal balance point is used determined in advance, then manufacturing simplicity is improved, but adaptability deteriorates as it cannot accommodate actual thermal variations
Solution Approach 1:
The patent applies preliminary action by measuring thermal characteristics during the post-silicon phase before finalizing the thermal ceiling configuration. Temperature sensors collect thermal data during initial operation, and this measured data is used to configure the thermal ceiling in advance, combining early measurement with subsequent adaptive control.
Solution Approach 2:
The patent implements feedback by using temperature sensors to continuously monitor actual thermal characteristics and feed this information back to the thermal control circuit. This feedback loop enables the system to adjust the thermal ceiling based on real temperature measurements, achieving adaptability while maintaining manageable complexity through automated control.
3Measurement precision
If per-functional-block thermal control is implemented, then thermal management precision is improved, but device complexity increases due to additional circuits and sensors
Solution Approach 1:
The patent applies segmentation by dividing the IC into multiple functional blocks, each with its own temperature sensor and thermal control circuit. This segmentation enables independent thermal management for each functional block, allowing precise temperature monitoring and control where needed while maintaining simpler thermal management for other blocks.
Solution Approach 2:
The patent implements local quality by applying different thermal control strategies to different functional blocks based on their specific thermal characteristics and requirements. Each functional block can have its own configurable thermal ceiling, allowing high-precision thermal management for critical blocks while using simpler control for less critical blocks, thus balancing precision with complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances system performance by allowing ICs to operate at their maximum capabilities while preventing overheating, avoiding abnormal operations, and optimizing thermal management across different functional blocks and systems.
Implementation Method 1
at least one temperature sensor can be coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block
Data Source
AI summary
An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block. The thermal control circuit performs thermal control on the first functional block to prevent the first functional block from overheating and inducing abnormal function operations, by monitoring the temperature sensing result and by trying to prevent the temperature sensing result from exceeding first temperature upper-limit, wherein the first temperature upper-limit is configurable with respect to per-functional-block thermal operation capability of the first functional block.