Perforated Chip Edge Seal for Optical Interconnects
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Solution Overview
Problem
Standard guard rings in semiconductor chips block light from entering or exiting Si waveguide structures, making them incompatible with optical interconnects, and fail to prevent crack propagation during the dicing process.
Innovation Solution
A perforated chip edge seal with a gap in the guard ring structure allows optical coupling through the gap, preventing crack propagation while enabling light transmission for optical interconnects by forming a waveguide structure on the chip with a fiber optic optically coupled to it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a standard guard ring structure is used to protect the chip edge and prevent crack propagation, then chip integrity and protection from moisture/ions are improved, but light transmission is blocked making optical interconnects incompatible
Solution Approach 1:
The continuous guard ring structure is segmented by introducing gaps at specific locations. These gaps allow light to pass through while the remaining portions of the guard ring continue to provide mechanical protection and crack prevention. The segmentation enables the guard ring to simultaneously fulfill its protective function and enable optical interconnect compatibility.
Solution Approach 2:
The guard ring structure is modified locally by creating gaps only at specific positions where optical coupling is needed, while maintaining the continuous protective structure in other regions. This local modification allows light transmission at critical points without compromising the overall protective function of the guard ring around the chip perimeter.
2Object-affected harmful factors
If the guard ring is made continuous to maximize protection, then crack prevention and moisture barrier effectiveness are improved, but light blocking increases preventing optical coupling
Solution Approach 1:
The continuous guard ring is divided into segments by introducing gaps. The segmented structure maintains crack prevention capability through the remaining continuous portions while allowing light to pass through the gaps. The segmentation strategy balances protective function with optical transmission requirements.
Solution Approach 2:
Specific portions of the guard ring are extracted or removed to create gaps. These extracted sections are strategically positioned to allow light transmission for optical coupling while the remaining guard ring structure continues to provide crack prevention and environmental protection.
3Adaptability or versatility
If gaps are introduced in the guard ring to enable light transmission, then optical interconnect compatibility is improved, but structural protection and crack prevention may be compromised
Solution Approach 1:
The guard ring is segmented with gaps positioned strategically to minimize impact on structural integrity. The segmentation allows optical coupling while the remaining continuous portions of the guard ring maintain edge protection and crack prevention capabilities.
Solution Approach 2:
The guard ring structure is modified locally with gaps only where optical coupling is required, while maintaining full protective coverage in other critical regions. This localized modification preserves the overall strength and protective function of the guard ring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for effective optical coupling and prevents crack propagation into the active area of the chip, enhancing the compatibility of Si waveguide structures with optical interconnects and maintaining chip integrity during the dicing process.
Implementation Method 1
Si waveguide structures integrated onto a CMOS die (chip)
Implementation Method 2
a fiber optic optically coupled to the waveguide structure through the gap formed in the guard ring structure
Data Source
AI summary
An integrated waveguide structure with perforated chip edge seal and methods of manufacture are disclosed herein. The structure includes a guard ring structure surrounding an active region of an integrated circuit chip. The structure further includes a gap in the guard ring structure which is located at a predetermined level of the integrated circuit chip. The structure further includes a waveguide structure formed on a substrate of the integrated circuit chip. The structure further includes a fiber optic optically coupled to the waveguide structure through the gap formed in the guard ring structure.