Perforated Conductive Material for Semiconductor EMI Shielding
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Solution Overview
Problem
Current EMI shielding methods, such as physical vapor deposition (PVD) sputtering, are costly, time-consuming, complex, and difficult to implement effectively in semiconductor devices, leading to increased sensitivity to electromagnetic interference as components shrink in size.
Innovation Solution
The use of a perforated conductive material, such as metal tape, metal foil, or porous copper foam, attached to a substrate with grounding pads and covered by a molding compound, provides efficient and cost-effective EMI shielding by creating system-in-a-package (SiP) units with integrated EMI protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PVD sputtering process is used for EMI shielding, then conductive material can be deposited on mold layer, but the process becomes costly, time-consuming, and complex
Solution Approach 1:
The patent replaces the expensive and complex PVD sputtering process with a simple perforated metal foil that can be easily applied and removed. The foil serves as a disposable EMI shielding layer that eliminates the need for costly deposition equipment and complex process steps, directly resolving the contradiction between shielding effectiveness and process complexity
Solution Approach 2:
The patent extracts the EMI shielding function from the complex PVD sputtering process and implements it through a separate, simple perforated metal foil component. This extraction allows the shielding function to be achieved independently without requiring the entire complex deposition process, thereby reducing overall process complexity while maintaining shielding effectiveness
2Reliability
If PVD sputtering process is used for EMI shielding, then conductive material layer can be formed, but the time to increase thickness is long
Solution Approach 1:
The perforated metal foil provides immediate EMI shielding without requiring time-consuming deposition processes. The foil can be applied instantly to achieve the desired shielding thickness, eliminating the prolonged deposition time associated with PVD sputtering while maintaining adequate conductive material thickness for effective EMI protection
Solution Approach 2:
The EMI shielding function is prepared in advance by creating a pre-formed perforated metal foil with appropriate thickness and conductivity. This preliminary preparation eliminates the need for time-consuming on-demand deposition, as the shielding layer is already ready for immediate application, thus resolving the time-consuming deposition issue
3Reliability
If PVD sputtering process is used for EMI shielding, then conductive coating can be applied, but cleaning mold surface becomes difficult
Solution Approach 1:
The perforated metal foil serves as a disposable shielding layer that does not require permanent adhesion to the mold surface. This eliminates the need for thorough cleaning to ensure adhesion, as the foil can be simply applied and later removed without leaving residues or requiring complex surface preparation, directly resolving the cleaning difficulty while maintaining effective EMI shielding
Solution Approach 2:
The EMI shielding function is extracted from the mold surface itself and implemented through a separate perforated metal foil. This extraction means the foil does not need to adhere permanently to the mold, eliminating the adhesion-related cleaning requirements and simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces electromagnetic interference within semiconductor devices, enhances heat dissipation, and simplifies the manufacturing process while maintaining cost efficiency and adhesion, addressing the limitations of traditional PVD sputtering.
Implementation Method 1
a perforated conductive material layered over the one or more devices and the one or more grounding pads
Implementation Method 2
enhances heat dissipation
Data Source
AI summary
An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.