Perforated Flexible Substrate for Stretchable Electronics
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Solution Overview
Problem
Existing flexible solar substrates and electronic modules lack stretchability, as they are primarily designed for bending and not for stretching, limiting their ability to conform to complex three-dimensional shapes and applications.
Innovation Solution
The implementation of a flexible substrate with strategically designed perforations that allow for stretchability, combined with the use of stretchable materials and encapsulation with elastomers to enhance durability and functionality, enabling the substrate to stretch in various directions while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the substrate is made thinner to improve flexibility, then bendability is improved, but mechanical strength deteriorates
Solution Approach 1:
The substrate uses a composite structure combining a thin flexible base layer with an overlying elastomeric encapsulation layer. This composite approach provides both the flexibility needed for bending applications and the mechanical strength required for durability, while the perforations enable stretchability without compromising the overall structural integrity.
2Adaptability or versatility
If perforations are added to enable stretching, then stretchability is improved, but manufacturing complexity deteriorates
Solution Approach 1:
The substrate employs a thin-film structure with integrated perforations that can be manufactured using existing flexible electronics fabrication techniques. The perforated design allows the substrate to function as a flexible shell that can stretch and conform to three-dimensional surfaces while maintaining electrical connectivity through carefully designed conductive trace routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables flexible substrates to stretch and conform to complex shapes, enhancing their versatility and durability, allowing for the integration of high-performance electronic components and improved manufacturing processes, such as roll-to-roll processing, while maintaining robust electrical connections.
Implementation Method 1
encapsulation with elastomers to enhance durability and functionality, enabling the substrate to stretch in various directions
Data Source
AI summary
An electronics module has a flexible substrate having conductors, an array of functional components on the substrate, the functional components arranged to contact at least one conductor, and perforations in the flexible substrate, the perforations arranged to increase stretchability of the flexible substrate, the conductor arranged around the perforation and the functional components arranged to one of reside between the perforations or partially cover the perforations. A method of manufacturing a flexible electronics module involves mounting at least two functional components onto a flexible substrate, forming electrical interconnects configured to provide connection between the two functional components, and perforating the flexible substrate with cuts configured to increase stretchability of the substrate.