Perforated Graphite Heat Array for Sealed Aircraft Bay Cooling
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Solution Overview
Problem
Sealed equipment bays in aircraft, which house heat-generating electronic components, face challenges in providing effective cooling to prevent premature failure due to moisture intrusion restrictions.
Innovation Solution
A heat transfer system is manufactured by creating a structural assembly with a heat conducting array, comprising perforated pyrolytic graphite sheets and thermally conductive foam elements, which allows for efficient heat dissipation through a network of thermally conductive members and pressure-sensitive adhesive layers, while maintaining structural integrity and moisture protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vents or louvers are used for cooling, then heat dissipation is improved, but moisture intrusion risk increases
Solution Approach 1:
The equipment bay is segmented into sealed and unsealed portions, with the heat-generating components located in the sealed portion and cooling vents positioned in the unsealed portion, allowing differential treatment of different functional zones
Solution Approach 2:
A thermal management system acts as an intermediary between the sealed equipment bay and the external environment, transferring heat from the sealed interior to the external cooling vents through thermally conductive pathways
2Object-affected harmful factors
If the equipment bay is sealed to prevent moisture intrusion, then moisture protection is improved, but cooling capability deteriorates
Solution Approach 1:
The cooling function is extracted from the sealed equipment bay and relocated to external vents, allowing the bay to remain sealed while still providing heat dissipation through external cooling structures
Solution Approach 2:
The natural convection cooling mechanism is replaced with a structured thermal management system that uses thermally conductive pathways and external vents to achieve more controlled and efficient heat transfer
3Temperature
If integrated fans or cooling ducts are added, then cooling capability is improved, but device complexity increases
Solution Approach 1:
The system utilizes natural convection and thermal conduction through existing structural components (skins, foam core, ribs) to achieve cooling without requiring additional active cooling devices like fans or complex ductwork
Solution Approach 2:
Existing structural components of the equipment bay (skins, foam core, ribs) are made to serve dual functions: providing structural support and facilitating heat transfer, thereby eliminating the need for dedicated cooling structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces temperature differences by dissipating heat generated by components, achieving a 14% reduction in heat transfer to the lower skin, thereby prolonging equipment lifespan and preventing premature failure.
Implementation Method 1
a heat conducting array, comprising perforated pyrolytic graphite sheets and thermally conductive foam elements, which allows for efficient heat dissipation
Implementation Method 2
thermally conductive foam elements, which allows for efficient heat dissipation through a network of thermally conductive members
Data Source
AI summary
A method of manufacturing a heat transfer system is provided that includes, in one form, preparing a heat conducting array by perforating at least a portion of the heat conducting array, placing the heat conducting array around foam elements, placing a heat conducting spreader along one surface area of the foam elements, placing a lower skin over the heat conducting spreader, placing an upper skin over an opposite surface area of the foam elements to create a structural assembly, and curing the structural assembly. A material of the foam elements flows through the perforated portion of the heat conducting array during the curing step.


