Perforated Lid Package Structure for Thermal Interface Stability

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Solution Overview

Problem

Existing electronic packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, low performance, and oversized packages.

Innovation Solution

The proposed electronic device comprises a substrate with a dielectric and conductive structure, a first electronic component coupled with the conductive structure, and a lid with a top plate having multiple holes, along with a covering material that extends between the substrate and the lid to cover the lateral side of the electronic component.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electronic packages are used, then manufacturing cost is reduced, but reliability decreases and thermal stress causes separation of thermal interface materials

Engineering Contradiction:

Improvethermal reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The lid is segmented with multiple holes that allow covering material to extend down and cover the lateral sides of electronic components. This segmentation approach enables the covering material to be positioned effectively for thermal management while maintaining manufacturing feasibility through standardized hole patterns and material application processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A covering material is introduced as an intermediary substance that fills the space between the lid and electronic components. This covering material serves as a thermal interface material that prevents separation caused by thermal stress while the holes in the lid enable proper positioning and attachment of this intermediary material.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If conventional packaging is used, then package size is reduced, but performance decreases due to excess cost and low performance

Engineering Contradiction:

ImproveperformanceVSAvoidpackage size

Core Design Contradiction:

ProductivityVSVolume of stationary object

Solution Approach 1:

The covering material extends into the vertical dimension by reaching down through the holes in the lid to cover the lateral sides of electronic components. This three-dimensional configuration improves thermal management performance without significantly increasing the horizontal package footprint, as the enhancement occurs primarily in the vertical dimension within the existing package envelope.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If thermal interface materials are used without proper positioning, then thermal conductivity is improved, but separation occurs due to thermal stress

Engineering Contradiction:

Improvethermal conductivityVSAvoidseparation resistance

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The covering material acts as a flexible thermal interface film that conforms to the lateral sides of electronic components. This flexible covering material maintains continuous thermal contact while accommodating thermal expansion and contraction, preventing separation that would occur with rigid thermal interface materials under thermal stress.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The package employs a composite structure where the covering material combines thermal conductivity properties with mechanical compliance. This composite approach integrates materials with different properties to achieve both effective thermal conduction and resistance to separation under thermal cycling conditions.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the reliability and performance of electronic devices by reducing thermal stress and preventing separation of thermal interface materials from the electronic component or lid, thereby improving thermal reliability.

Implementation Method 1

enhances the reliability and performance of electronic devices by reducing thermal stress and preventing separation of thermal interface materials

Methodology Applied

Scientific EffectThermal stress reduction: Thermal Expansion

Data Source

PatentUS20250132220A1Electronic devices and a methods of manufacturing electronic devices

Publication Date: 2025.04.24 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device comprises a substrate comprising a dielectric structure and a conductive structure, a first electronic component over a top side of the substrate and coupled with the conductive structure, a lid over the first electronic component and coupled with a top side of the substrate, wherein the lid comprises a top plate having a plurality of holes, and a covering material covering a lateral side of the first electronic component and extending between the top side of the substrate and a bottom side of the top plate of the lid. Other examples and related methods are also disclosed herein.