Perforated PCB Shield for Radar Cooling
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Solution Overview
Problem
Conventional cooling methods for high power amplifiers in radar installations require significant air flow, which increases power consumption and heat generation, while shielding devices can inhibit air flow and hinder cooling.
Innovation Solution
A perforated shield configured to provide both mechanical protection and enhanced cooling for electronic components, with customizable perforation patterns and materials to optimize heat dissipation and minimize power consumption, while also serving as a radio frequency and electromagnetic interference screen.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional shield is provided to protect electronic components, then mechanical protection is improved, but air flow is inhibited and cooling is hindered
Solution Approach 1:
The shield is provided with an array of perforations that allow cooling air to pass through while maintaining mechanical protection. The perforated structure enables simultaneous achievement of shielding and cooling functions by allowing fluid flow through the protective barrier.
Solution Approach 2:
The shield serves multiple functions: mechanical protection, RF shielding, EMC shielding, and cooling air flow passage. By integrating these functions into a single component with perforations, the design eliminates the need for separate shielding and cooling structures.
2Temperature
If significant air flow is used to cool electrical components, then cooling efficiency is improved, but power consumption and heat generation increase
Solution Approach 1:
The perforation parameters (number, spacing, distribution, magnitude) are optimized to achieve effective cooling with minimized air flow requirements. This allows the system to maintain adequate cooling while reducing the power needed to drive the cooling air flow.
3Strength
If a shield is added to protect PCB components, then mechanical protection is improved, but structural loading burden increases
Solution Approach 1:
The shield is constructed from thin metallic or metallised material that provides adequate mechanical and electromagnetic protection while maintaining minimal weight. This thin-film approach reduces the structural loading burden on the radar installation framework.
Solution Approach 2:
The shield may use composite or metallised materials that provide high strength-to-weight ratio, delivering mechanical protection and electromagnetic shielding properties while minimizing weight addition to the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves efficient cooling with reduced power consumption and structural loading, maintaining component performance and extending service life while minimizing heat generation and weight.
Implementation Method 1
the shield being sealably connected to the PCB, such that the TRU comprises an inlet defined by the arrays of perforations configured to permit ingress of cooling fluid and an outlet configured to permit egress of cooling fluid
Implementation Method 2
the shield may be configured to serve as a radio frequency interference screen
Implementation Method 3
the shield may be configured to serve as an electromagnetic interference screen
Implementation Method 4
By customising the distance of the shielding surface from particular components to be cooled, the characteristics of an impingement jet, formed in operation of the device, can be carefully controlled. This control is further enhanced by the selection of the number of perforations, the pattern of the perforations, the diameter of the perforations and/or the density of the perforations such that an optimum level of heat dissipation is achieved.
Data Source
Figure 1
Figure 2~3b
Figure 4~5
AI summary
A printed circuit board shield (100) is provided. The shield comprises a sealing surface (120) and a shielding surface (110). The sealing surface is configured to cooperate with, and be connectable to, a sealing region of a printed circuit board (80) upon assembly therewith. The shielding surface is substantially parallel to but offset from, the sealing surface. A concave cover for receiving at least part of the printed circuit board is thereby defined. The shielding surface comprises an array of perforations (130) formed therethrough. The array of perforations is configured to correspond to a location of an electronic component mounted on the printed circuit board.