Perimeter Antiwarpage Structure for IC Packaging

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Solution Overview

Problem

Conventional semiconductor package structures face challenges with miniaturization, leading to reliability issues and increased costs due to warpage during the solder reflow process, particularly in package-on-package designs, which affects the mechanical and electrical connections between the package and the PCB.

Innovation Solution

The integration of a perimeter antiwarpage structure on the package carrier provides structural rigidity and improved reliability by forming a mechanical and electrical connection with the PCB during the reflow process, minimizing warpage and enhancing the structural integrity of the integrated circuit packaging system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If package-on-package designs are miniaturized to reduce size and improve portability, then device size is reduced, but warpage susceptibility during solder reflow increases

Engineering Contradiction:

Improvepackage sizeVSAvoidwarpage resistance

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The antiwarpage structure is divided into discrete segments positioned at specific locations around the package perimeter. These segmented structures can be independently formed and positioned to provide localized support where warpage is most likely to occur during solder reflow, while maintaining overall package miniaturization.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The antiwarpage structures are strategically positioned at specific locations around the package perimeter rather than uniformly distributed. This localized approach provides enhanced warpage resistance at critical areas while minimizing added size and complexity, resolving the contradiction between miniaturization and reliability.

Inventive Principle:

Principle #3Local quality

2Strength

If perimeter antiwarpage structures are added to reduce warpage, then structural rigidity is improved, but device complexity increases

Engineering Contradiction:

Improvestructural rigidityVSAvoidpackage structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The antiwarpage structures are integrated with the existing package substrate and connection structures. The same peripheral regions that provide mechanical support also serve as locations for solder connections, merging multiple functions into unified structural elements that reduce overall complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The perimeter structures serve dual purposes: providing antiwarpage support during solder reflow and serving as mechanical and electrical connection points to the PCB. This multi-functionality reduces the need for separate components, thereby reducing device complexity while maintaining structural rigidity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Manufacturing precision

If antiwarpage structures are formed on package carrier, then manufacturing precision is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improveconnection uniformityVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The antiwarpage structures are formed on the package carrier during the manufacturing process before final assembly. This preliminary formation ensures that the structures are precisely positioned and integrated into the package substrate, improving manufacturing precision while utilizing existing manufacturing steps to minimize process complexity.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8994192B2Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof

Publication Date: 2015.03.31 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A method of manufacture of an integrated circuit packaging system comprising: providing a package carrier; mounting an integrated circuit to the package carrier; and forming a perimeter antiwarpage structure on and along a perimeter of the package carrier.