Gas Distribution Ring Channels for Uniform Process Chamber Flow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In plasma processing for integrated chip fabrication, uneven gas flow rates through gas vents in the shielding inset of process chambers lead to inconsistent material deposition and reliability issues, causing damage to the chamber components over time.
Innovation Solution
A gas distribution ring with evenly spaced gas inlets and conveyance channels is integrated within the shielding inset to ensure equal path lengths for gas flow, distributing process gas uniformly across the chamber and preventing peeling between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gas is supplied directly to gas vents without a distribution ring, then the structure is simple, but gas flow rates are uneven causing inconsistent deposition
Solution Approach 1:
The gas distribution ring segments the gas supply into multiple controlled pathways. The ring structure divides the single gas source into multiple gas inlets around the perimeter, with each inlet feeding a dedicated gas conveyance channel. This segmentation allows independent control and equal distribution of gas flow to multiple vents, ensuring uniform deposition across the substrate surface.
Solution Approach 2:
The gas distribution ring acts as an intermediary component between the gas source and the gas vents. It includes gas inlets positioned around its perimeter and gas conveyance channels that extend from these inlets to corresponding gas vents. This intermediary structure equalizes the gas flow path lengths and resistance, ensuring uniform gas distribution to all vents regardless of their position.
2Reliability
If gas conveyance paths have unequal lengths, then the structure is simpler, but gas flow rates vary causing peeling between components
Solution Approach 1:
The gas distribution ring is designed to create equipotential gas flow paths. All gas conveyance channels extend from the gas distribution ring to gas vents at equal distances, ensuring that the gas flow path length and resistance are equalized across all channels. This equipotential design prevents pressure differentials that would cause uneven gas flow and subsequent peeling between the shielding inset and process chamber.
3Manufacturing precision
If gas inlets are not evenly spaced, then manufacturing is easier, but deposition uniformity deteriorates
Solution Approach 1:
The gas distribution ring implements local quality by positioning gas inlets at specific equidistant locations around its perimeter. Each gas inlet is strategically placed to correspond with a gas vent position, ensuring that the gas flow distribution matches the spatial requirements for uniform deposition. This localized positioning of gas inlets at critical points around the ring ensures consistent material deposition across the substrate.
Data Source
AI summary
The present disclosure relates to an integrated chip processing tool. The integrated chip processing tool includes a gas distribution ring configured to extend along a perimeter of a process chamber. The gas distribution ring includes a lower ring extending around the process chamber. The lower ring has a plurality of gas inlets arranged along a bottom surface of the lower ring and a plurality of gas conveyance channels arranged along an upper surface of the lower ring directly over the plurality of gas inlets. The gas distribution ring further includes an upper ring disposed on the upper surface of the lower ring and covering the plurality of gas conveyance channels. A plurality of gas outlets are arranged along opposing ends of the plurality of gas conveyance channels. A plurality of gas conveyance paths extending between the plurality of gas inlets and the plurality of gas outlets have approximately equal lengths.