Perimeter Sensing Wires for Fast Semiconductor Damage Detection
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently determining and locating damage during assembly or other processes, necessitating lengthy software- and firmware-based failure analysis.
Innovation Solution
A semiconductor device with a wire placed along its perimeter and processing circuitry to detect damage based on signal integrity, optionally with a seal ring and multiple wires in different layers, determines damage through digital or analog signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If software- and firmware-based failure analysis is used to determine damage in semiconductor devices, then comprehensive analysis capability is achieved, but the process becomes extremely time-consuming
Solution Approach 1:
The patent applies preliminary action by pre-placing sensing wires within the semiconductor device structure before damage can occur. These wires are positioned to detect damage events as they happen, eliminating the need for time-consuming post-damage software analysis. The sensing infrastructure is prepared in advance, enabling immediate detection and localization of damage when it occurs.
2Measurement precision
If multiple wires are placed throughout the semiconductor substrate to locate damage precisely, then damage location precision is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the semiconductor substrate into multiple zones, each monitored by dedicated sensing wires. This segmentation allows precise localization of damage to specific regions without requiring a dense network of wires throughout the entire device. The segmentation strategy optimizes the balance between detection precision and structural simplicity.
Solution Approach 2:
The sensing wires serve multiple functions: they detect the presence of damage, locate the damage position, and can potentially assess damage severity. This multi-functionality reduces the need for separate detection systems, thereby minimizing device complexity while achieving comprehensive damage monitoring capabilities.
3Reliability
If sensing wires are integrated within the semiconductor substrate layers, then damage detection capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the sensing wire integration with existing semiconductor manufacturing processes. The wires are incorporated during standard fabrication steps rather than requiring separate post-manufacturing installation. This merging approach enables damage detection capability to be built into the device structure without significantly increasing manufacturing complexity or requiring additional specialized process steps.
Data Source
AI summary
A semiconductor device may include a semiconductor substrate, a wire placed along at least a portion of a perimeter of the semiconductor substrate, and processing circuitry connected to the wire, the processing circuitry to, based on a signal from the wire, determine whether or not the semiconductor device is damaged.