Periodic Acid Remover for Semiconductor Substrate Surface Smoothness
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Solution Overview
Problem
Current methods for removing transition metal-containing substances from semiconductor substrates do not simultaneously achieve sufficient dissolving ability and surface smoothness, leading to potential performance issues in semiconductor products due to high surface roughness.
Innovation Solution
A chemical solution comprising periodic acids and specific compounds with iodine anions, such as iodic acid, is used to effectively remove transition metal-containing substances, optimizing both dissolving ability and surface smoothness by controlling the concentration and pH of the solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional remover solutions are used to remove transition metal-containing substances, then the dissolving ability is improved, but the surface roughness increases
Solution Approach 1:
The patent applies parameter changes by carefully controlling the concentration of periodic acid (0.01-10% by mass) and the content of iodine-containing compounds (5ppb-1% by mass) in the remover solution. By adjusting these chemical parameters within specific ranges, the solution achieves optimal balance between dissolving ability and surface smoothness, resolving the contradiction between effective removal and surface quality
Solution Approach 2:
The patent uses a composite chemical solution containing multiple components: periodic acid as the primary dissolving agent, iodine-containing compounds (such as iodic acid, iodide, or triiodide) as auxiliary agents, and water as the solvent. This composite formulation synergistically enhances both the dissolving capability and surface smoothing effect, simultaneously addressing both requirements
2Productivity
If stronger dissolving agents are used to increase dissolving ability, then the removal efficiency is improved, but the surface smoothness deteriorates
Solution Approach 1:
The patent implements parameter changes by optimizing the concentration of periodic acid within a specific range (0.01-10% by mass) and controlling the addition of iodine-containing compounds (5ppb-1% by mass). This controlled parameter adjustment ensures high removal efficiency while preventing excessive surface roughness, resolving the contradiction between productivity and precision
Solution Approach 2:
The patent introduces iodine-containing compounds (iodide I⁻, triiodide I₃⁻, or iodic acid HIO₃) as intermediary substances that mediate between the periodic acid and the transition metal-containing substances. These intermediaries enhance the dissolving ability through chemical reactions while simultaneously contributing to surface smoothing, thus improving removal efficiency without sacrificing surface quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent dissolving ability and smoothness of the substrate surface, improving the performance and quality of semiconductor products by effectively removing transition metal-containing substances while maintaining substrate smoothness.
Implementation Method 1
a chemical solution including periodic acids and a predetermined amount of a compound... for removing a transition metal-containing substance on a substrate
Implementation Method 2
the dissolving ability for the transition metal-containing substances... by using a chemical solution including periodic acids and a compound including iodine anions
Data Source
AI summary
The present invention provides a chemical solution, which has an excellent dissolving ability for a transition metal-containing substance and can realize excellent smoothness of a portion to be treated, and a treatment method using the chemical solution. The chemical solution according to an embodiment of the present invention is a chemical solution used for removing a transition metal-containing substance on a substrate and includes periodic acids and a compound including one or more kinds of anions selected from the group consisting of IO3−, I−, and I3−, in which a content of the compound including anions with respect to a total mass of the chemical solution is 5 ppb by mass to 1% by mass.