Peripheral Circuit Temperature Adjustment for Cryogenic Overclocking
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Solution Overview
Problem
During extreme overclocking of CPU, GPU, or memory modules, the peripheral circuit elements on a motherboard are either not cooled optimally or cooled too much, leading to inefficient operation of the overclocking target elements due to suboptimal working temperatures.
Innovation Solution
A temperature adjustment module comprising a temperature control module, a temperature changing module, and a temperature sensor that detects the peripheral temperature and adjusts it to a target temperature using heat conduction materials and temperature-variable components to ensure optimal operation of peripheral circuit elements during the cooling process of main circuit elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If liquid nitrogen or liquid helium is used to cool down the overclocking target element, then the frequency of the overclocking target element may be increased to an extremely high frequency, but the peripheral circuit element may be simultaneously cooled down to an insufficient extent, resulting in the actual operating efficiency being unable to achieve the corresponding efficiency improvement effect
Solution Approach 1:
The patent applies local quality by providing separate temperature control for different regions: the main circuit element (overclocking target) and the peripheral circuit element. The first temperature control module controls the main circuit element to achieve extreme cooling for high frequency, while the second temperature control module independently controls the peripheral circuit element to maintain optimal working temperature, ensuring both high frequency operation and reliable efficiency
Solution Approach 2:
The patent segments the temperature control system into independent modules: a first temperature control module for the main circuit element and a second temperature control module for the peripheral circuit element. This segmentation allows each module to operate independently with different temperature settings, enabling the main element to be cooled to extreme temperatures for overclocking while the peripheral element maintains optimal temperature for efficient operation
2Speed
If the peripheral circuit element is cooled down to extremely low temperature, then the main circuit element can operate at high frequency, but the peripheral circuit element cannot work normally due to insufficient cool down
Solution Approach 1:
The patent implements local quality by applying different temperature conditions to different components: the main circuit element receives extreme cooling for high-frequency operation, while the peripheral circuit element receives controlled cooling to maintain optimal working temperature. This is achieved through separate temperature control modules that can independently adjust temperatures based on the specific requirements of each component
Solution Approach 2:
The patent introduces a second temperature control module as an intermediary between the cooling system and the peripheral circuit element. This intermediary module regulates the temperature of the peripheral element, preventing excessive cooling while allowing the main circuit element to be cooled to extreme temperatures. The second temperature control module acts as a buffer that ensures the peripheral element operates within optimal temperature ranges
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains peripheral circuit elements at optimal working temperatures, ensuring the main circuit elements operate efficiently during overclocking by dynamically adjusting temperatures to prevent overheating or undercooling, thereby enhancing overall system performance.
Implementation Method 1
The temperature sensor is in contact with the peripheral circuit element
Implementation Method 2
The temperature changing module is in contact with the peripheral circuit element
Data Source
Figure 1~2
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AI summary
A temperature adjustment module (100, 200) and a temperature adjustment method are provided. The temperature adjustment module (100, 200) includes a temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112), a temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920, 1021-1024, 1121-1124), and a temperature sensor (230). The temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920,1021-1024, 1121-1124) is in contact with a peripheral circuit element (302-304, 501, 601) and electrically connected to the temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112). The temperature sensor (230) is in contact with the peripheral circuit element (302-304, 501, 601) and electrically connected to the temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112). When a cool down module (310) on a main circuit element (301) of a mother board (300, 500, 1000, 1100) cools down the main circuit element (301), the temperature sensor (230) detects a peripheral temperature of the peripheral circuit element (302-304, 501, 601). The temperature control module (110, 210, 510, 610, 1011, 1012, 1111, 1112) determines whether the peripheral temperature is lower than or higher than a target temperature to determine whether to operate the temperature changing module (120, 220, 320-340, 520, 620, 720, 820, 920,1021-1024, 1121-1124) to perform temperature adjustment on the peripheral circuit element (302-304, 501, 601).