Peripheral Component Coupler Staggered Pin Configuration
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Solution Overview
Problem
The challenge is to enhance the input/output performance of peripheral components in computing devices without increasing the physical space on printed circuit boards (PCBs), as the size of these components is constrained by the device's form factor, and existing coupler structures do not support higher performance without additional space.
Innovation Solution
The solution involves a PCIe card and connector design with staggered or interweave configurations of pins/signal traces on different planes or the same plane, allowing for higher density connections without direct electrical coupling between rows, enabling increased computing performance while occupying the same or reduced space on the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional coupler structures are used on PCBs, then the device can operate, but the input/output performance is limited due to space constraints
Solution Approach 1:
The patent transitions from a traditional single-plane pin arrangement to a multi-dimensional staggered configuration where pins are distributed across multiple planes and rows. This spatial reorganization allows significantly more pins (up to 256 or more) to be accommodated within the same PCB footprint, directly resolving the contradiction between I/O performance and PCB space by exploiting additional dimensional space.
Solution Approach 2:
The coupler structure is segmented into multiple rows and planes of pins rather than using a single dense array. This segmentation allows for better signal trace routing, reduced interference between adjacent pins, and more efficient use of the available PCB area, enabling higher pin counts without proportionally increasing the occupied area.
2Productivity
If more pins/signal traces are added to increase data transfer capacity, then computing performance improves, but the physical footprint on PCB increases
Solution Approach 1:
By distributing pins across multiple planes and implementing a staggered row configuration, the patent effectively uses three-dimensional space rather than limiting pins to a single two-dimensional plane. This allows the coupler to achieve up to 256 or more pins while maintaining a compact footprint, directly addressing the contradiction between data transfer capacity and physical footprint.
3Quantity of substance
If higher density pin configurations are used, then more connections are possible in less space, but signal interference and manufacturing complexity increase
Solution Approach 1:
The coupler structure divides the pin array into multiple segmented rows and planes, which simplifies the routing of signal traces compared to a single dense array. This segmentation allows for more manageable trace lengths, reduced crosstalk between adjacent signals, and easier manufacturing, thereby enabling higher connection density without proportionally increasing device complexity.
Data Source
AI summary
Apparatus and method to facilitate increased input/output performance are disclosed herein. An apparatus may include one or more computing components; a first row of a plurality of pins and a second row of a plurality of pins located on a first side of the apparatus, wherein the first row is disposed on the first side between the one or more computing components and the second row; and a third row of a plurality of pins and a fourth row of a plurality of pins located on a second side of the apparatus, wherein the third row is disposed on the second side between the one or more computing components and the fourth row, and the second side to comprise a side opposite the first side, wherein the first, second, third, and fourth rows lack direct electrical coupling with each other and are electrically coupled to the one or more computing components.