Peripheral Exhaust Layout for Uniform Substrate Heat Treatment
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently managing the removal of sublimates generated during heat treatments, which can lead to device clogging and thermal deterioration of components.
Innovation Solution
A substrate processing apparatus with a hot plate and chamber configuration that includes a gas discharger to supply gas uniformly across the substrate surface and a peripheral exhaust device to evacuate the processing space from the outer periphery, controlled by a controller to manage gas flow and exhaust, reducing the risk of clogging and thermal deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a central exhaust device is used to remove sublimates during heat treatment, then the exhaust efficiency is improved, but it causes gas flow that affects film thickness uniformity and causes clogging
Solution Approach 1:
The exhaust function is segmented from the center to the periphery. The exhaust device is positioned at the outer peripheral region rather than the center, dividing the gas flow path and exhaust function to avoid disrupting the uniform gas flow across the substrate surface during heat treatment
2Object-generated harmful factors
If exhaust is performed during heat treatment, then sublimate removal is improved, but thermal deterioration of components occurs
Solution Approach 1:
A cold shield is introduced as an intermediary component between the substrate and the exhaust path. The cold shield captures and condenses sublimates before they can travel to and cause thermal deterioration of downstream components, acting as a protective barrier
Solution Approach 2:
The exhaust device is extracted from the central position and relocated to the outer peripheral region. This spatial extraction allows exhaust to occur without creating harmful thermal pathways to sensitive components while maintaining sublimate removal efficiency
3Manufacturing precision
If gas is discharged uniformly across the substrate, then film formation is improved, but clogging occurs in the exhaust path
Solution Approach 1:
The exhaust path is segmented and positioned at the periphery, separate from the uniform gas discharge region. This spatial segmentation allows uniform gas flow for film formation while the peripheral exhaust path efficiently removes sublimates without clogging the central discharge holes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses clogging and thermal deterioration by uniformly distributing gas and evacuating sublimates, ensuring stable and efficient heat treatment processes.
Implementation Method 1
a hot plate configured to support a substrate having a film formed thereon and perform a heat treatment of heating the substrate
Implementation Method 2
efficiently managing the removal of sublimates generated during heat treatments
Implementation Method 3
a gas discharger, having a head member provided with multiple discharge holes distributed along a surface facing the substrate supported by the hot plate, configured to discharge a gas toward a surface of the substrate from the multiple discharge holes
Implementation Method 4
a peripheral exhaust device configured to evacuate a processing space within the chamber from an outer peripheral region outside a periphery of the substrate supported by the hot plate
Data Source
AI summary
A substrate processing apparatus includes a hot plate configured to support a substrate having a film formed thereon and perform a heat treatment of heating the substrate; a chamber configured to cover the substrate supported by the hot plate; a gas discharger, having a head member provided with multiple discharge holes distributed along a surface facing the substrate supported by the hot plate, configured to discharge a gas toward a surface of the substrate from the multiple discharge holes; a peripheral exhaust device configured to evacuate a processing space within the chamber from an outer peripheral region outside a periphery of the substrate supported by the hot plate; and a controller. The controller controls the peripheral exhaust device to increase an exhaust amount from the peripheral exhaust device in a state that the substrate is heated.