Peripheral Head Support Layout for Low-Vibration Substrate Bonding
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Solution Overview
Problem
The existing bonding device configuration results in high vibration amplitudes due to a vertically positioned Z-axis ascent/descent driving mechanism, leading to reduced alignment precision and increased variation in contact positions between substrates, thereby deteriorating positional precision during bonding.
Innovation Solution
A bonding device with a head holder extending orthogonally from the stage, supported by holder supports and driven by support drivers, reduces the distance from the ground, minimizing vibration amplitudes and enhancing positional precision by adjusting the head's position relative to the stage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a Z-axis ascent/descent driving mechanism is arranged vertically directly above the head and supported by a support frame, then the head can be driven to ascend and descend, but height from the ground to the driving mechanism becomes high, causing large vibration amplitude and deteriorating alignment precision
Solution Approach 1:
The support structure transitions from a vertical arrangement (Z-axis directly above head) to a horizontal arrangement (outer peripheral portion surrounding the stage). The holder supports are positioned at the outer periphery of the stage rather than vertically above the head, changing the spatial dimension of support from vertical to horizontal, thereby reducing height and vibration while maintaining driving capability
2Ease of operation
If the Z-axis ascent/descent driving mechanism is positioned high above the ground, then the head can be driven vertically, but the vibration amplitude of the head and stage increases, causing large relative vibration amplitude and deteriorating bonding positional precision
Solution Approach 1:
The support mechanism is relocated from a high vertical position to a horizontal perimeter position around the stage. The holder supports are arranged at the outer periphery of the stage, changing the spatial configuration from vertical stacking to horizontal distribution, which reduces vibration amplitude while preserving the vertical driving function
Solution Approach 2:
The support function is divided into multiple holder supports positioned at different locations around the outer periphery of the stage. Instead of a single centralized vertical support, the system uses distributed peripheral supports, which reduces the height of individual support structures and minimizes vibration amplitude while maintaining overall stability
Data Source
AI summary
A bonding device (1) includes a stage (141) to hold a substrate (W1), a head (142) arranged facing the stage (141) and configured to hold a substrate (W2), a head holder (111) to hold the head (142) on the opposite side to the stage (141) side of the head (142), the head holder (111) extending to the outer side of the head (142) and the stage (141) in a direction orthogonal to the Z-axis direction, three holder supports (1471) each to support the head holder (111) from one of three locations in an outer peripheral portion surrounding the stage (141), and three support drivers (146) to individually move the three holder supports (1471) in a −Z-direction in which the head holder (111) and the stage (141) come close to each other or a +Z-direction in which the head holder (111) and the stage (141) separate from each other.