Display Peripheral Pad Structure for Signal Isolation and Bending Reliability
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Solution Overview
Problem
The increasing number of signal lines and pads in electronic apparatuses leads to mutual interference between electronic components and signal lines, affecting electrical reliability and bending reliability.
Innovation Solution
The electronic apparatus incorporates a power pattern and sensing pads on a non-bending portion, with the sensing pads overlapping the power pattern, and a bridge line connecting the main pad to the sensing pad, all while using a stress relaxation layer and encapsulation layers to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of signal lines and pads is increased to support higher processing speeds and data processing, then processing capability is improved, but the likelihood of mutual interference between electronic components and signal lines increases
Solution Approach 1:
The patent transitions from planar signal line arrangement to three-dimensional vertical stacking of signal lines across multiple layers. This dimensional change allows multiple signal lines to coexist without lateral interference, enabling increased data processing capacity while maintaining signal integrity through vertical separation of signal paths.
Solution Approach 2:
The patent introduces shielding layers as intermediary structures positioned between signal lines and pads. These shielding layers act as mediators that block electromagnetic interference between adjacent signal lines, allowing higher signal densities to be packed together without mutual interference, thus supporting increased processing speeds while maintaining reliability.
2Area of stationary object
If sensing pads are positioned to overlap with power pattern, then space utilization is improved, but electrical interference between sensing and power signals may occur
Solution Approach 1:
The patent positions sensing pads and power patterns in overlapping planar locations but separates them vertically across different layers. This three-dimensional arrangement allows maximum space utilization in the planar view while preventing electrical interference through vertical isolation, enabling both functions to coexist in the same footprint area.
Solution Approach 2:
The patent introduces insulating layers as intermediary structures between the sensing pads and power patterns. These insulating layers act as mediators that electrically isolate the sensing signals from power signals, allowing the pads to overlap in planar space without causing electrical interference, thus achieving both space efficiency and signal integrity.
3Reliability
If multiple layers are added to separate signal lines and pads, then signal interference is reduced, but device complexity increases
Solution Approach 1:
The patent designs the multi-layer structure so that each layer serves multiple functions: signal transmission, power distribution, shielding, and insulation. By making each layer multi-functional, the patent reduces the total number of layers needed compared to a dedicated single-function approach, thereby reducing device complexity while maintaining signal interference prevention.
Solution Approach 2:
The patent combines multiple functions into integrated structures, such as combining shielding and signal transmission in the same layer, or merging power distribution and insulation functions. This merging reduces the overall layer count and structural complexity while achieving the required signal separation and interference prevention.
Data Source
AI summary
An electronic apparatus includes a base substrate having an active area and a peripheral area adjacent to the active area. A plurality of pixels is disposed on the active area. The electronic apparatus also includes a plurality of power lines connected to the pixels. A power pad is disposed on a peripheral area and is configured to receive a power voltage. A power pattern is disposed on the peripheral area and connecting the power lines to the power pad. A plurality of sensing electrodes is disposed on the pixels in the active area. A plurality of sensing pads is disposed on the peripheral area and is electrically connected to the sensing electrodes. The sensing pads overlap with the power pattern.