Peripheral RF Feed Chuck Assembly Azimuthal Uniformity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Non-uniform etching in wafer processing for integrated circuits leads to yield reduction, especially as critical dimensions shrink and wafer sizes increase, necessitating stringent control of non-uniformity to enable advanced technology nodes in cost-effective mass production.

Innovation Solution

A chuck assembly with a peripheral RF feed and symmetric RF return system, where RF power is delivered via a hollow feed contacting the facility plate's periphery, bypassing central conducting components, and a grounded shield provides a symmetrical RF return path, ensuring high azimuthal uniformity and minimizing interference from components like heating and clamping devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If RF power is delivered through a central feed to the facility plate, then the RF power can be effectively transmitted, but the conducting components (heating devices, clamping devices, lift pins) within the central region interfere with the RF field distribution, causing azimuthal non-uniformity

Engineering Contradiction:
ImproveRF power transmissionVSAvoidazimuthal uniformity
Core Design Contradiction:
PowerVSManufacturing precision

Solution Approach 1:

The RF feed is segmented into a peripheral portion that contacts only the peripheral region of the facility plate, separating the RF power delivery path from the central conducting components. This segmentation prevents interference between RF fields and central components, achieving both effective power transmission and azimuthal uniformity

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A dielectric material is introduced as an intermediary between the peripheral RF feed and the facility plate. This dielectric layer enables RF power transmission while electrically isolating the feed from direct contact with the conductive facility plate, reducing unwanted RF interactions and improving field distribution uniformity

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If conducting components (heating devices, clamping devices, lift pins) are placed in the central region of the facility plate, then the chuck assembly can perform thermal control and mechanical operations, but these components disrupt the symmetry of the RF field, increasing azimuthal non-uniformity

Engineering Contradiction:
Improvethermal control and mechanical operationsVSAvoidazimuthal uniformity
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The RF feed is extracted from the central region and repositioned to the periphery of the facility plate. This extraction removes the source of RF interference from the central conducting components, allowing both the thermal/mechanical functions and azimuthal uniformity to coexist

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The RF power delivery is moved from a two-dimensional central plane to a three-dimensional peripheral configuration. The hollow feed structure extends vertically and peripherally, delivering RF power from a different spatial dimension that avoids interference with central components while maintaining field symmetry

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces azimuthal non-uniformity, maintaining low levels across a range of RF power settings and improving etch rates and residual scans, enhancing the uniformity and efficiency of plasma processing.

Implementation Method 1

a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate

Methodology Applied
Scientific EffectRF power delivery: Electromagnetic Induction

Implementation Method 2

a symmetrical, grounded shield substantially surrounding the peripheral RF feed

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 3

an electrostatic chuck having a substrate support surface on a first side

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Data Source

PatentUS8898889B2Chuck assembly for plasma processing
Publication Date: 2014.12.02 LAM RES CORP
  • US8898889B2 patent drawing
  • US8898889B2 patent drawing
  • US8898889B2 patent drawing

AI summary

Systems and methods are presented for a peripheral RF feed and symmetric RF return for symmetric RF delivery. According to one embodiment, a chuck assembly for plasma processing is provided. The chuck assembly includes an electrostatic chuck having a substrate support surface on a first side, a facility plate coupled to the electrostatic chuck on a second side that is opposite the substrate support surface, a peripheral RF feed configured to deliver RF power, the peripheral RF feed having a first portion contacting a periphery of the facility plate and an RF strap coupling the peripheral RF feed to an RF source.