Peripheral Semiconductor Layout for Die Size Reduction
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Solution Overview
Problem
Large-current semiconductor devices in integrated circuits occupy significant areas, making it challenging to reduce die size while maintaining effective current transmission.
Innovation Solution
A semiconductor device layout where the semiconductor element occupying the largest area is arranged on the periphery of the circuit core area, surrounding it, thereby reducing die size and enhancing current transmission capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If large-current semiconductor devices are placed in the core circuit area, then current transmission capability is improved, but die size increases
Solution Approach 1:
The patent inverts the conventional layout by placing the large-current semiconductor device (ESD clamp or power transistor) in the periphery area instead of the core circuit area. This inversion allows the device to surround the core circuit area, achieving both large current transmission capability and reduced die size by optimizing the spatial arrangement.
Solution Approach 2:
The patent transitions from a planar arrangement where large devices occupy core area to a peripheral arrangement where the device surrounds the core area. This dimensional reconfiguration allows the large-current device to be positioned in the periphery while maintaining its current transmission function and reducing the overall die size.
2Power
If the largest semiconductor element is placed in the core circuit area, then current transmission is effective, but the circuit core area is reduced
Solution Approach 1:
The patent inverts the conventional layout by placing the large-current semiconductor device (ESD clamp or power transistor) in the periphery area instead of the core circuit area. This inversion allows the device to surround the core circuit area, achieving both large current transmission capability and reduced die size by optimizing the spatial arrangement.
Solution Approach 2:
The large-current semiconductor device is arranged to surround the core circuit area, creating a nested configuration where the core circuit is enclosed by the protective ESD clamp or power transistor. This nesting allows the largest device to be positioned peripherally while maintaining its function and preserving the core circuit area.
3Reliability
If ESD clamp occupies significant area in core circuit, then ESD protection function is improved, but die size increases
Solution Approach 1:
The patent inverts the conventional layout by placing the ESD clamp in the periphery area instead of the core circuit area. The ESD clamp surrounds the core circuit area, maintaining its electrostatic discharge protection function while reducing the die size by optimizing the spatial arrangement of the protection circuit.
Solution Approach 2:
The ESD clamp is arranged to surround the core circuit area, creating a nested configuration where the core circuit is enclosed by the protective clamp. This nesting allows the ESD protection device to be positioned peripherally while maintaining its protection function and preserving the core circuit area.
Data Source
AI summary
A semiconductor device includes a semiconductor substrate and a first semiconductor element. The semiconductor substrate has a circuit core area. The first semiconductor element is arranged on the semiconductor substrate and at least partially surrounds the periphery of the circuit core area. A layout area of the first semiconductor element is larger than a layout area of any of the semiconductor elements in the circuit core area.