Peripheral Support Structure for Moisture-Resistant Electronic Packaging
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Solution Overview
Problem
Existing electronic devices face challenges in improving reliability and display quality, particularly in the peripheral regions where structural integrity and moisture resistance are compromised.
Innovation Solution
The electronic device incorporates a planarization layer with openings and a specific configuration of support members and package elements, enhancing adhesion and stress buffering through alignment layers and insulating layers, ensuring consistent thickness and improved structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planarization layer with openings is used to improve adhesion and stress buffering, then structural reliability is improved, but device complexity increases
Solution Approach 1:
The planarization layer is segmented into multiple regions with different thicknesses, creating openings that expose underlying layers. This segmentation allows the structure to buffer stress more effectively while maintaining adhesion, resolving the contradiction between reliability and complexity by making the layer composition more varied rather than uniformly complex
Solution Approach 2:
Different regions of the planarization layer have different local properties (thickness variations, openings in peripheral regions versus continuous structure in active regions). This local quality approach improves structural reliability where needed without unnecessarily increasing complexity across the entire device structure
2Reliability
If support members are positioned to overlap conductive elements for adhesion improvement, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The support members are positioned to overlap conductive elements and active devices before final assembly steps. This preliminary positioning ensures proper adhesion and alignment are established early in the manufacturing process, reducing the precision requirements for subsequent steps while maintaining reliability
3Reliability
If the insulating layer includes recesses overlapped with package elements, then moisture resistance is improved, but device complexity increases
Solution Approach 1:
The insulating layer is modified with recesses only in specific regions where package elements are located, rather than uniformly across the entire layer. This local modification improves moisture resistance at critical interfaces without unnecessarily increasing the complexity of the overall insulating layer structure
Data Source
AI summary
The electronic device includes a first substrate, an active device, a first conductive element, an insulating layer, a first support member, a second support member, and a package element. The active device is disposed on the first substrate and includes a gate and a semiconductor layer. The first conductive element is disposed on the first substrate and is a same layer of the gate of the active device. The insulating layer is disposed on the substrate. The first support member is disposed on the insulating layer and overlaps the first conductive element. The second conductive element is disposed on the first substrate. The second support member overlaps the second conductive element. The package element is disposed on the first substrate.