Peripheral Wiring Pairs for Narrow Border Electronic Devices
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Solution Overview
Problem
The configuration of peripheral wirings in electronic blackboards with touch display functions makes it difficult to reduce the borders of the devices, limiting their integration and efficiency.
Innovation Solution
The electronic device incorporates a substrate with interlaced first and second peripheral areas, featuring first and second electrodes and conductive layers with alternately arranged peripheral wiring pairs, an insulating layer, and contact windows, allowing for electrical connections that balance impedance and reduce border thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple peripheral wirings are disposed on the left and right sides to electrically connect touch electrodes, then electrical connectivity is achieved, but the left and right borders cannot be reduced
Solution Approach 1:
The patent transitions from planar peripheral wiring arrangements to a three-dimensional stacked configuration. Multiple peripheral wirings are arranged in different layers (first peripheral wiring layer and second peripheral wiring layer) with vertical stacking, allowing electrical connections to be established through the thickness dimension rather than only through lateral expansion, thus reducing border width while maintaining connectivity.
Solution Approach 2:
The patent implements nesting by placing peripheral wirings of different layers within the same border region. The first peripheral wirings and second peripheral wirings are stacked vertically within the same horizontal footprint, allowing multiple electrical connection paths to coexist in the same spatial envelope, thereby reducing the overall border width required for electrical connectivity.
2Reliability
If peripheral wirings are arranged to connect touch electrodes, then electrical connectivity is achieved, but impedance balance becomes difficult to maintain
Solution Approach 1:
The patent applies local quality by making the thickness of peripheral wirings vary according to their specific positions and functions. Different peripheral wirings in different layers or regions are assigned different thicknesses to optimize their electrical characteristics locally, enabling impedance balance to be achieved through localized parameter adjustment rather than uniform design.
Solution Approach 2:
The patent utilizes parameter changes by adjusting the thickness parameter of peripheral wirings as a design variable. By varying the thickness of first peripheral wirings and second peripheral wirings based on their positional requirements and electrical function, the patent achieves impedance balance through controlled parameter modification rather than fixed-dimensional design.
Data Source
AI summary
An electronic device, including a substrate, first electrodes, second electrodes, and peripheral wiring pairs, is provided. The substrate has a first peripheral area, a working area, and a second peripheral area arranged along a first direction. The first electrodes are disposed in the working area, structurally separated from each other, and arranged along a second direction. The second electrodes are disposed in the working area, structurally separated from each other, and arranged along the first direction. Each peripheral wiring pair includes first and second peripheral wirings respectively belonging to first and second conductive layers. One of the first and second peripheral wirings is disposed in one of the first and second peripheral areas. Other one of the first and second peripheral wirings is disposed in other one of the first and second peripheral areas. The first and second peripheral wirings are electrically connected to the same first electrode.