Periphery Cover Body Sealing for Substrate Temperature Uniformity
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in efficiently and effectively heating substrates during liquid processing, particularly in maintaining temperature uniformity and preventing chemical liquids from entering gaps between the substrate and the processing equipment, which can lead to inefficiencies and contamination.
Innovation Solution
The substrate processing apparatus employs a rotary table with a circular attraction plate and a hot plate, featuring multiple heating zones and a water-repellent processing system to maintain temperature control and prevent liquid ingress, utilizing a periphery cover body to seal gaps and ensure efficient liquid processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is heated by a fluid (processing liquid and/or gas) existing between the substrate and the heater, then the substrate can be heated during liquid processing, but the temperature uniformity and heating efficiency are insufficient
Solution Approach 1:
The hot plate is divided into multiple heating zones (first heating zone and second heating zone) with different heating capacities. The first heating zone corresponds to the central portion of the substrate and has a larger heating capacity, while the second heating zone corresponds to the peripheral portion and has a smaller heating capacity. This segmentation allows differential heating control to achieve uniform temperature distribution across the substrate surface.
Solution Approach 2:
Different regions of the hot plate are assigned different heating characteristics. The central region (first heating zone) provides stronger heating than the peripheral region (second heating zone), creating a non-uniform heating distribution that compensates for the natural tendency of heat to concentrate at the center, thereby achieving uniform overall temperature distribution on the substrate.
2Adaptability or versatility
If processing liquid is supplied onto the substrate during heating, then liquid processing can be performed, but the processing liquid may enter gaps between the substrate and the processing equipment causing contamination
Solution Approach 1:
A peripheral cover body is introduced as an intermediary component between the substrate and the processing chamber wall. This cover body extends radially outward from the substrate periphery and downward, creating a barrier that prevents processing liquid from entering the gap between the substrate and the processing equipment, thus avoiding contamination while allowing liquid processing to proceed.
3Productivity
If the processing liquid enters the gap between the substrate and the heater, then liquid can be supplied for processing, but heating efficiency decreases and temperature control becomes difficult
Solution Approach 1:
The peripheral cover body acts as a barrier that intercepts processing liquid before it can reach the gap between the substrate and the hot plate. By blocking the liquid path, the cover body prevents liquid from interfering with the heating process, thereby maintaining heating efficiency and temperature control while still allowing liquid processing to occur.
4Reliability
If a sealed environment is created to prevent liquid ingress, then contamination is prevented, but device complexity increases
Solution Approach 1:
The peripheral cover body provides a simple yet effective sealing solution by extending radially and downward from the substrate periphery. This single component creates a barrier that prevents liquid ingress without requiring complex multi-component sealing systems, thus achieving reliable contamination prevention with minimal increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature control and uniform heating of substrates, preventing liquid contamination and enhancing processing efficiency by maintaining a sealed environment and effective liquid management.
Implementation Method 1
an electric heater provided at the top plate and configured to heat the substrate through the top plate
Implementation Method 2
a water-repellent processing system to maintain temperature control and prevent liquid ingress
Data Source
AI summary
A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; a processing liquid nozzle configured to supply a processing liquid onto a top surface of the substrate; an electric heater provided at a top plate and configured to heat the substrate through the top plate; an electronic component configured to perform a power feed to the electric heater and transmission/reception of a control signal for the electric heater; and a periphery cover body connected to a peripheral portion of the top plate to be rotated along with the top plate. An accommodation space in which the electronic component is accommodated is formed under the top plate. The accommodation space is surrounded by a surrounding structure including the top plate and the periphery cover body. A gap between the peripheral portion of the top plate and the periphery cover body is sealed.