Peristaltic Pump for Power Electronics Thermal Management
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Solution Overview
Problem
Thermal management systems in electrified vehicles face challenges in maintaining uniform temperature conditions for power electronics components, leading to performance degradation due to varying temperatures and coolant flow disturbances caused by complex coolant paths.
Innovation Solution
A power electronics assembly incorporating a peristaltic pump system with electromagnets or voltage-emitting emitters that adjust the cross-sectional area of coolant channels using magnetic or dielectric particles, allowing for controlled coolant flow rates and temperatures through targeted delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant channels are designed with complex paths to reach all power electronics components, then thermal coverage is improved, but flow uniformity deteriorates due to varying path lengths and resistances
Solution Approach 1:
The patent applies dynamic control by using variable frequency drives to independently adjust the speed of multiple coolant pumps, and by using adjustable flow control valves to dynamically balance coolant flow distribution across different thermal zones, allowing the system to adapt to varying thermal loads and maintain uniform flow despite complex channel paths
Solution Approach 2:
The system incorporates temperature sensors and flow sensors that provide real-time feedback to the control system, which then adjusts pump speeds and valve positions to maintain optimal coolant flow distribution and temperature uniformity across all power electronics components
2Temperature
If multiple coolant pumps are used to serve different thermal zones, then thermal management coverage is improved, but system complexity increases
Solution Approach 1:
The patent designs the coolant pumps and control system to perform multiple functions: the same pump system can serve both cooling and heating operations, and the control system can manage multiple thermal zones using a unified control architecture, reducing the need for completely separate systems for different thermal management tasks
3Temperature
If coolant flow rate is increased to improve cooling efficiency, then heat dissipation is improved, but temperature uniformity deteriorates due to excessive flow causing thermal shocks
Solution Approach 1:
The system uses dynamic flow control with variable frequency drives on coolant pumps and adjustable flow control valves to optimize coolant flow rates in real-time, increasing flow when high cooling efficiency is needed while maintaining temperature uniformity through precise control that prevents thermal shocks from excessive flow rates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages thermal conditions by dynamically adjusting coolant flow, reducing temperature gradients and performance degradation, and enhancing the longevity and efficiency of power electronics components.
Implementation Method 1
The wall may include magnetic particles and the emitter may be an electromagnet to selectively output a magnetic field to impart a force on the particles
Implementation Method 2
the emitter may selectively output a magnetic field to impart a force on the particles to move the membrane
Implementation Method 3
the emitter may selectively output a voltage or electric field to impart a dielectrically driven compression force on the particles
Implementation Method 4
the emitter may selectively output a voltage or electric field to impart a dielectrically driven compression force on the particles to adjust the cross-sectional area
Implementation Method 5
The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough
Implementation Method 6
The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the power electronics device
Data Source
AI summary
A power electronics assembly may include a power electronics device, a packaging assembly, a thermal management system, and an emitter. The packaging assembly supports power electronics device. The thermal management system supports the packaging assembly and includes a thermal plate to deliver coolant for thermally communicating with the device. The thermal plate defines a channel with a wall. The emitter is arranged with the wall to form a peristaltic pump to adjust a cross-sectional area of the channel to control a flow of coolant therethrough. A membrane may be partially secured to the wall and include one of dielectric particles or magnetic particles. The emitter may selectively output one of a voltage, an electric field, or a magnetic field to impart a force on the particles to move the membrane and adjust the cross-sectional area of the channel to control a flow of coolant therethrough.