Permalloy Core Inductor Stack for Compact Package Integration
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Solution Overview
Problem
The semiconductor industry faces challenges in integrating inductors efficiently into smaller packaging systems due to the need for higher integration density and compact designs, which often results in reduced performance and increased manufacturing costs.
Innovation Solution
The use of a permalloy core with vertically stacked alternating permalloy and epoxy layers, forming a closed loop shape, enhances magnetic permeability and inductance, allowing for more efficient and compact power inductors that can be integrated into existing processes with improved performance and lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If inductors are integrated into smaller packaging systems to increase integration density, then more components can be integrated into a given area, but inductor performance is reduced and manufacturing costs increase
Solution Approach 1:
The patent transitions from planar inductor designs to three-dimensional vertically stacked inductor structures. Multiple inductor windings are stacked vertically with magnetic cores positioned between them, enabling higher integration density while maintaining individual inductor performance characteristics. This vertical stacking approach allows inductors to occupy the third dimension rather than competing for planar space.
Solution Approach 2:
The patent employs composite magnetic core structures combining different magnetic materials with varying permeability values. High-permeability magnetic cores are used in specific positions within the stacked inductor structure to optimize magnetic flux distribution and maintain inductance values despite the compact vertical arrangement. This composite material approach allows performance preservation while achieving miniaturization.
2Productivity
If inductors are integrated into smaller packaging systems to increase integration density, then more components can be integrated into a given area, but manufacturing costs increase
Solution Approach 1:
The patent combines multiple inductor windings and magnetic cores into a single integrated stacked structure that can be manufactured as one unit. This merging of previously separate inductor components into a unified vertical stack reduces the number of discrete manufacturing steps and assembly operations, thereby lowering manufacturing costs despite the increased integration density.
Solution Approach 2:
The stacked inductor structure serves multiple functions simultaneously - each vertical stack contains multiple inductors that can be used for different circuit functions (power filtering, RF applications, etc.). This multi-functionality reduces the need for separate inductor components and assemblies, simplifying the manufacturing process and reducing overall costs while achieving high integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in higher inductance and more efficient inductor performance, facilitating easier integration into semiconductor packages while reducing manufacturing costs and improving space utilization.
Implementation Method 1
The use of a permalloy core with vertically stacked alternating permalloy and epoxy layers, forming a closed loop shape, enhances magnetic permeability and inductance
Implementation Method 2
The permalloy core with vertically stacked alternating permalloy and epoxy layers, forming a closed loop shape, enhances magnetic permeability and inductance
Data Source
AI summary
A package includes a first redistribution structure, a die disposed over the first redistribution structure, a molding material surrounding the die, a second redistribution structure over the die and the molding material, and an inductor includes a permalloy core. The permalloy core is embedded in the molding material, and the permalloy core includes vertically stacked alternating layers. The vertically stacked alternating layers includes epoxy layers, and permalloy layers, where each of the permalloy layers is disposed between two epoxy layers of the epoxy layers.