Permalloy Package Inductor Layout for High-Frequency Voltage Regulation
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Solution Overview
Problem
Integration of voltage regulators and wafer-level packaging poses a challenge in semiconductor device manufacturing, particularly in achieving effective power management for high-frequency electronic devices.
Innovation Solution
A method involving the formation of a package with a first redistribution structure, a die, a permalloy structure, and a second redistribution structure, where the permalloy structure is sandwiched between conductive patterns and through vias, and encapsulated with a molding material, forming an inductor with high inductance for efficient power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If voltage regulators are integrated with wafer-level packaging, then power management efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the voltage regulator die with the wafer-level packaging substrate by forming conductive patterns directly on the substrate that connect to pads on the voltage regulator die. This integration combines power management functionality with the packaging substrate, improving power management efficiency while managing complexity through a unified structure rather than separate components.
Solution Approach 2:
The wafer-level packaging substrate serves multiple functions: it acts as both the packaging substrate and the circuit board for the voltage regulator. The conductive patterns on the substrate provide both mechanical support and electrical connectivity, allowing the substrate to perform multiple roles and reducing overall device complexity despite the integrated functionality.
2Reliability
If conductive patterns are formed on the substrate, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive patterns are formed on the substrate before the voltage regulator die is mounted. This preliminary formation of conductive structures allows for pre-testing and adjustment of electrical connectivity before final assembly, ensuring proper electrical connections while simplifying the overall manufacturing process by separating the conductive pattern formation from the die attachment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables compact, high-frequency voltage regulation and effective power management in electronic devices while simplifying the fabrication process and enhancing integration with conventional processes.
Implementation Method 1
the permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern
Data Source
AI summary
A package includes first and second redistribution structures, a die, a permalloy structure, a molding material and a plurality of through vias. The first redistribution structure includes a first metal pattern. The die is disposed over the first redistribution structure. The molding material is disposed over the first redistribution structure and surrounds the die and the permalloy structure. The second redistribution structure is disposed over the die, the permalloy structure and the molding material, and includes a second metal pattern. The through vias penetrate the molding material and connects the first metal pattern to the second metal pattern. The permalloy structure includes a first member and a second member isolated from the first member, the first member and the second member are surrounded by the plurality of through vias and sandwiched between the first metal pattern and the second metal pattern. A method for forming a package is also provided.